Method of fabricating flexible substrate structure
A technology of flexible substrates and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, coatings, electrical components, etc., can solve problems such as yellow light lithography alignment accuracy errors, deformation, and difficulty in making electronic components, and achieve improved alignment Accuracy and the effect of improving yield rate
Inactive Publication Date: 2013-03-13
IND TECH RES INST
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Problems solved by technology
[0003] At present, the substrates used in the general roll-to-roll continuous process are flexible plastic substrates such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and the types of products are as follows: Single-layer patterning of indium tin oxide (ITO) thin films, or single-layer patterning of multi-layer thin films is the main method. For the production and development of electronic components, more than two layers of yellow light lithography must be used. Due to the flexible plastic substrate The film stress in the process and the tension of the rolling bar of the equipment will seriously deform the substrate, resulting in a large error in the alignment accuracy of the yellow light lithography above the second layer, making the production of electronic components quite difficult
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[0043] figure 1 A schematic cross-sectional view of a flexible substrate structure according to an embodiment of the present invention is shown. figure 2 A top view of a flexible substrate structure according to an embodiment of the present invention is shown. image 3 A top view of another flexible substrate structure according to an embodiment of the present invention is shown. Figure 4 draw figure 1 A top view of yet another flexible substrate structure according to an embodiment of the present invention.
[0044] Please refer to figure 1 , the flexible substrate structure 20 of the present invention includes a flexible metal carrier 10 , a surface modification layer 12 and a flexible plastic substrate 14 .
[0045] The flexible metal carrier 10 includes a first region 10A and a second region 10B. The second area 10B is located around the first area 10A, and above the first area 10A is, for example, an area for forming flexible electronic components, and above the se...
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A method of fabricating a flexible substrate structure is provided. A flexible metal carrier including at least one first region and at least one second region is provided. A surface-modified layer is formed on the first region of the flexible metal carrier. A flexible plastic substrate is formed over the first region and the second region of the flexible metal carrier. The flexible plastic substrate over the first region contacts with the surface-modified layer. The flexible plastic substrate over the second region contacts with the flexible metal carrier.
Description
technical field [0001] The present invention relates to a substrate structure and its manufacturing method, and in particular to a flexible substrate structure and its manufacturing method. Background technique [0002] The Roll-to-Roll (Roll-to-Roll) continuous process has the advantages of low construction cost and large area, which is very suitable for the thin film transistor array process, and it is better than the current silicon semiconductor sheet-to-sheet (sheet-to-sheet) Process has a more competitive advantage. [0003] At present, the substrates used in the general roll-to-roll continuous process are flexible plastic substrates such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and the types of products are as follows: Single-layer patterning of indium tin oxide (ITO) thin films, or single-layer patterning of multi-layer thin films is the main method. For the production and development of electronic components, more than two layers of yell...
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IPC IPC(8): H01L27/12H01L21/77
CPCB05D3/12H01L29/78603H01L27/1218B05D5/00Y10T428/24355Y10T156/10Y10T156/1052
Inventor 叶永辉郑君丞吕奇明曾永隆
Owner IND TECH RES INST