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Waste circuit board processing method

A treatment method and technology of waste circuit boards, which are applied in the field of resource recovery and treatment of waste circuit boards, can solve the problems of mutagenesis, teratogenicity, loss of useful resources, etc., and achieve the effects of convenient operation, cost reduction, and high metal purity

Inactive Publication Date: 2013-03-27
DALIAN DONGTAI INDAL WASTE TREATMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If it is not properly handled and disposed of, it will not only cause a large loss of useful resources, but also contain a large number of teratogenic, mutagenic, and carcinogenic substances such as cadmium brominated flame retardants, which will seriously affect the environment and human health.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The waste circuit board processing method comprises the following steps:

[0019] (1) Crushing and separation: first directly crush the circuit board, remove iron through magnetic separation and separation, then remove resin powder through electrostatic separation, and finally obtain metal powder;

[0020] (2) Dissolution: Put the metal powder obtained in step (1) in a mixed acid solution, and add hydrogen peroxide to promote dissolution; the mixed acid solution is sulfuric acid and hydrochloric acid with a concentration of 6mol / L and a mass ratio of 1: 1 mixed;

[0021] (3) Filtration: filtering the solution in step (2) to obtain a solution containing metal ions;

[0022] (4) Ion exchange: Use ion exchange resin to extract precious metals and other metals.

[0023] In this embodiment, the amount of hydrogen peroxide added in step (2) is 12wt% of the metal powder.

[0024] In this embodiment, the mass ratio of the metal powder to the mixed acid solution in step (2) i...

Embodiment 2

[0026] The waste circuit board processing method comprises the following steps:

[0027] (5) Crushing and separation: first directly crush the circuit board, remove iron through magnetic separation, then remove resin powder through electrostatic separation, and finally obtain metal powder;

[0028] (6) Dissolution: Put the metal powder obtained in step (1) in a mixed acid solution, and add hydrogen peroxide to promote dissolution; 1 mixed;

[0029] (7) Filtration: filtering the solution in step (2) to obtain a solution containing metal ions;

[0030] (8) Ion exchange: Use ion exchange resin to extract precious metals and other metals.

[0031] In this embodiment, the amount of hydrogen peroxide added in step (2) is 18wt% of the metal powder.

[0032] In this embodiment, the mass ratio of the metal powder to the mixed acid solution in step (2) is 1:5.

Embodiment 3

[0034] The waste circuit board processing method comprises the following steps:

[0035] (9) Crushing and separation: firstly crush the circuit board directly, remove iron through magnetic separation and separation, then remove resin powder through electrostatic separation, and finally obtain metal powder;

[0036] (10) Dissolution: Put the metal powder obtained in step (1) in a mixed acid solution, and add hydrogen peroxide to promote dissolution; the mixed acid solution is sulfuric acid and hydrochloric acid with a concentration of 6mol / L and a mass ratio of 1: 1 mixed;

[0037] (11) Filtration: filtering the solution in step (2) to obtain a solution containing metal ions;

[0038] (12) Ion exchange: Use ion exchange resin to extract precious metals and other metals.

[0039] In this embodiment, the amount of hydrogen peroxide added in step (2) is 15wt% of the metal powder.

[0040] In this embodiment, the mass ratio of the metal powder to the mixed acid solution in step ...

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PUM

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Abstract

The invention provides a waste circuit board processing method which comprises the following steps of: breaking and separation: firstly, directly breaking the circuit board, removing iron through magnetic separation, and removing resin powder through electrostatic separation to obtain metal powder; dissolving: placing the obtained metal powder in a mixed acid solution, and adding hydrogen peroxide to promote the dissolution; filtration: filtering the dissolved solution to obtain a solution containing metal ions; and ion exchange: extracting metal by use of ion exchange resin.

Description

technical field [0001] The invention belongs to the field of solid waste treatment, and in particular relates to a resource recycling treatment method for waste circuit boards. Background technique [0002] The development of economy and the progress of science and technology make the electronic industry develop rapidly, which brings profound changes to the production and life style of human beings. At the same time, due to the continuous shortening of the replacement cycle of electronic products, a large number of electronic products are scrapped after reaching the end of their service life and become electronic waste. The resulting electronic waste is growing at a rate of 18% every year, becoming the fastest growing waste in the world. Of. Discarded circuit boards are the most complex components and structures in electronic waste, and are also the most difficult to handle. If left untreated, randomly piled up or landfilled, or improperly disposed of, they will pose a grea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22B7/00
CPCY02P10/20
Inventor 陈刚
Owner DALIAN DONGTAI INDAL WASTE TREATMENT
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