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A high-speed digital signal processing platform chassis with automatic temperature control and heat dissipation device

A high-speed digital signal and processing platform technology, applied in the direction of machine/engine, non-electric variable control, pump control, etc., can solve the problems of short fan life, inconvenient installation, high power consumption, etc., to reduce power consumption, prolong life, The effect of increasing the overall usage time

Active Publication Date: 2016-01-27
MIANYANG WEIBO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its shortcoming is that the patent application technology of this invention cannot dissipate heat for high-speed digital processing platform chassis with high power consumption, and this cooling method has high power consumption, short fan life, loud noise, and inconvenient installation

Method used

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  • A high-speed digital signal processing platform chassis with automatic temperature control and heat dissipation device
  • A high-speed digital signal processing platform chassis with automatic temperature control and heat dissipation device
  • A high-speed digital signal processing platform chassis with automatic temperature control and heat dissipation device

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Embodiment Construction

[0022] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0023] Such as figure 1 As shown, the high-speed digital signal processing platform chassis of the present invention uses an automatic temperature control cooling device, which mainly includes a hardware part and control software. The bottom plate 8 in the hardware part is tightly fixed on the chassis 1 by screws, and then the 6U machine is fastened by reinforcing screws. The frame 4 is fixed on the bottom plate 8 and the two walls of the chassis. The power module 3, the main board 7 and the high-speed digital signal processing board group 6 are inserted into the guide rail grooves in the 6U frame 4. The interfaces are consistent with the interfaces provided on the bottom plate 8. The fan Group 5 is inserted into the chassis 1 at a position close to the 6U rack 4 and perpendicular to the installation direction of the high-speed digital signal processing...

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Abstract

The invention provides an automatic temperature control radiator for a case of a high-speed digital signal processing platform. A bottom plate in hardware of the radiator is fixed on the case, a 6U frame is fixed on the bottom plate, a power supply module, a main board and a high-speed digital signal processing board card set are inserted in a guide groove of the 6U frame, a fan set is installed at a position close to the 6U frame and perpendicular to the installed direction of the high-speed digital signal processing board card set, a temperature sensor is installed in a cavity of the high-speed digital signal processing board card set, a temperature acquisition device, a single chip microcomputer control system and control end operation software of the fan set are used for fuzzy computing and allow feedback control for the fan set. Radiating of a system operating at high speed such as the high-speed digital signal processing platform can be achieved, radiating efficiency is high, power consumption of a whole machine is reduced, the service life of fans of the fan set is prolonged, and noise caused by the fans is lowered.

Description

technical field [0001] The invention belongs to the field of heat dissipation and control of electronic equipment, and in particular relates to an automatic temperature control heat dissipation device for a chassis of a high-speed digital signal processing platform. Background technique [0002] At present, because the high-speed digital signal processing platform chassis contains a main board and multiple high-speed digital signal processing boards, the power consumption is generally more than a kilowatt, so the heat is very large, and it requires certain environmental adaptability. Traditional heat dissipation devices use heat sinks in the core heating area and add fans to reduce the temperature of the chassis. This method is generally not conducive to the environmental adaptability of the product. For example, the heat sink is easy to fall off in a vibration environment, and the fan It has been controlled according to a certain operation and cannot be installed, thereby w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05D23/20H05K7/20F04D27/00
Inventor 严发宝梅勇张建陈刚涂炯陈先玉付斌
Owner MIANYANG WEIBO ELECTRONICS