Metal nanoparticle paste, electronic component assembly using metal nanoparticle paste, LED module, and method for forming circuit for printed wiring board

A technology of metal nanoparticles and atoms, applied in printed circuits, printed circuits, electric solid devices, etc., to achieve high reflectivity, excellent reflectivity, excellent reflectivity and thermal conductivity

Active Publication Date: 2013-03-27
NAT INST FOR MATERIALS SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is the problem that the above-mentioned technology must strictly control the reaction atmosphere and use special equipment.

Method used

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  • Metal nanoparticle paste, electronic component assembly using metal nanoparticle paste, LED module, and method for forming circuit for printed wiring board
  • Metal nanoparticle paste, electronic component assembly using metal nanoparticle paste, LED module, and method for forming circuit for printed wiring board
  • Metal nanoparticle paste, electronic component assembly using metal nanoparticle paste, LED module, and method for forming circuit for printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～11、 comparative example 1～6

[0083] Hereinafter, an example in which the metal nanoparticle paste of the present invention is used as a conductive bonding material will be described.

[0084] (1) Compounding ingredients of metal nanoparticle paste

[0085] Conductive material

[0086] ·Metal nanoparticles covered by a protective film (hereinafter referred to as "coated metal nanoparticles")

[0087] Coated metal nanoparticles I: Tin nanoparticles are coated with a protective film composed of a sorbitan fatty acid ester of formula (I-1) by the above-mentioned active continuous interface vapor deposition method.

[0088] Coated metal nanoparticles II: Tin nanoparticles are coated with a protective film composed of oleylamine of formula (IV-1) by the above-mentioned active continuous interface vapor deposition method.

[0089] Coated metal nanoparticle III: The silver nanoparticle is coated with a protective film composed of the sorbitan fatty acid ester of the formula (I-1) by the active continuous interface vapor dep...

Embodiment 12～14、 comparative example 7

[0117] Hereinafter, an example in which the metal nanoparticle paste of the present invention is used as a wiring material will be described.

[0118] (1) Compounding ingredients of metal nanoparticle paste

[0119] Conductive material

[0120] The coated metal nanoparticle III and the coated metal nanoparticle IV are the same as the above-mentioned example in which the metal nanoparticle paste is used as the conductive bonding material.

[0121] The metal nanoparticle VI is a particle without a coating formed by a protective film.

[0122] (2) Preparation method of metal nanoparticle paste used as wiring material

[0123] A predetermined amount of the cyclohexane dispersion containing 20% ​​by mass of coated metal nanoparticles obtained by the above-mentioned active continuous interface vapor deposition method was put into an agate mortar, and all the cyclohexane components were volatilized by vacuum drying to obtain a content of 20% by mass. % Protective film composition coated metal ...

Embodiment 15～19、 comparative example 8～10

[0137] Hereinafter, an example in which the metal nanoparticle paste of the present invention is used as a coating film and bonding material having high reflectance will be described.

[0138] (1) Compounding ingredients of metal nanoparticle paste

[0139] Conductive material

[0140] -The coated metal nanoparticle III is the same as the coated metal nanoparticle III of the above-mentioned example in which the metal nanoparticle paste is used as the conductive bonding material.

[0141] ·The silver powder is "AgC-A" manufactured by Futian Metal Co., Ltd.

[0142] Dispersion medium

[0143] Terpineol C: a mixture of α-terpineol, β-terpineol, and γ-terpineol manufactured by Terpineol, Japan. The existing chemical substances are No. 3-2323, CAS. No. 8000-41-7, and the purity is over 85% by mass.

[0144] ·Dihydroterpineol: manufactured by Terpene Co., Ltd., 1-hydroxy-pair Alkane and 8-hydroxy-pair A mixture of alkanes. The existing chemical substances are No. 3-2315, CAS. No. 498-81-7, ...

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Abstract

Disclosed is a metal nanoparticle paste that uses the low-temperature sintering characteristics of metal nanoparticles to easily obtain a metal bond with excellent conductivity and mechanical strength, and which can form a wiring pattern with excellent conductivity. The metal nanoparticle paste is characterized by containing (A) metal nanoparticles, (B) a protective film that coats the surface of the metal nanoparticles, (C) a carboxylic acid, and (D) a dispersion medium.

Description

Technical field [0001] The present invention relates to a metal nanoparticle paste containing metal nanoparticles and carboxylic acids whose surfaces are covered with a protective film. More specifically, it relates to the ability to form wiring on a substrate by printing such as screen printing or inkjet printing through a very low temperature heat treatment Pattern and metal nanoparticle paste that can bond electronic devices on a substrate through a very low temperature heat treatment. Background technique [0002] In recent years, in the field of mounting electronic devices on substrates, for electrical joining, lead-free solder, especially tin-silver-copper alloy solder has become the mainstream, but because the mounting temperature is very high, 240°C or higher, Therefore, it cannot handle all electronic devices or substrates. For example, when using a substrate with poor heat resistance, such as PET, or when low-temperature bonding is required due to heat resistance of co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/00H01B13/00H05K1/09H05K3/10H05K3/12
CPCH01L24/83H05K3/3484H01L2224/2949H05K2203/122H01L24/29C09D11/52H01L2224/293H05K1/181H01B1/22H05K1/097H05K2203/0425H01L2224/8384H05K3/3431H05K2201/10106H05K2203/1131H01L2924/12041H01L2924/15788H01L2924/12042H01L2924/12044H05K3/3485H01L2924/00H01B13/00H05K1/09H05K3/10H05K3/12
Inventor 中谷功广濑正人原岛启太栗田聪清田达也
Owner NAT INST FOR MATERIALS SCI
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