SnCuNiGaGeIn serial silver-free and lead-free solder alloy

A lead-free solder alloy, weight percentage technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of large amount of phosphorus volatilization, large tin slag, affecting product quality, etc., to improve resistivity, Use effect is good, the effect of improving anti-oxidation performance

Active Publication Date: 2013-04-03
上海一远电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its disadvantage is that the maximum use temperature of the added phosphorus element can only reach 420 ℃ ~ 450 ℃, when the use temperature of the solder reaches 420 ℃, a large amount of phosphorus will volatilize, and a large amount of tin slag will appear, which seriously affects the product quality

Method used

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  • SnCuNiGaGeIn serial silver-free and lead-free solder alloy

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Experimental program
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Effect test

Embodiment 1

[0023] A kind of SnCuNiGaGeIn system silver-free lead-free solder alloy, this lead-free solder alloy is made up of the weight percent of following composition:

[0024] Cu: 0.5%; Ni: 0.01%; Ga+Ge: 0.005%, where the weight ratio of Ga+Ge is 1:1; In: 0.09%; the balance is Sn, which also contains inevitable impurities.

[0025] The preparation method of the silver-free lead-free solder alloy of the present embodiment is as follows:

[0026] A. Add Ni to the vacuum high-frequency electric furnace according to the above weight percentage, and then add a part of Sn. The weight ratio of Sn to Ni added is 9:1. Raise the temperature to 1600°C and keep it for 30 minutes, take it out of the furnace, cool and cast Sn-Ni alloy ingot;

[0027] B. Put the Sn-Ni alloy ingot alloy obtained in step A and the remaining Sn into an intermediate frequency electric furnace, heat up to 480° C., smelt, and keep warm for 30 minutes; then, cool down to 320° C., add Cu, Stir Ga and Ge for 30 minutes. A...

Embodiment 2

[0029] A kind of SnCuNiGaGeIn system silver-free lead-free solder alloy, this lead-free solder alloy is made up of the weight percent of following composition:

[0030] Cu: 0.6%; Ni: 0.01%; Ga: 0.0025%; Ge: 0.0027%; In: 0.09%; the balance is Sn, including unavoidable impurities.

[0031] The preparation method of the silver-free lead-free solder alloy of this embodiment is consistent with the method of embodiment 1, the only difference is that the weight percentage of each component of the silver-free lead-free solder alloy of the SnCuNiGaGeIn system is added according to the ratio of this embodiment, and will not be repeated here. .

Embodiment 3

[0033] A kind of SnCuNiGaGeIn system silver-free lead-free solder alloy, this lead-free solder alloy contains the weight percent of following composition:

[0034] Cu: 0.6%; Ni: 0.02%; Ga: 0.003%; Ge: 0.0025%; In: 0.08%; the balance is Sn, including unavoidable impurities.

[0035] The preparation method of the silver-free lead-free solder alloy of this embodiment is consistent with the method of embodiment 1, the only difference is that the weight percentage of each component of the silver-free lead-free solder alloy of the SnCuNiGaGeIn system is added according to the ratio of this embodiment, and will not be repeated here. .

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PUM

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Abstract

The invention relates to a SnCuNiGaGeIn serial silver-free and lead-free solder alloy, and belongs to the technical field of welding materials. In order to solve problems of weak high-temperature resistance, much tin slag and weak ductility in the existing solder, the SnCuNiGaGeIn serial silver-free and lead-free solder alloy is provided; the solder comprises the following components in percentage by weight: 0.1% to 1.0% of Cu, 0.01% to 1.0% of Ni, 0.01% to 1.0% of In, 0.002% to 0.004% of Ga, 0.002% to 0.004% of Ge, and the balance of tin. 0.005% to 0.008% of Dy and/or Er and 0.002% to 0.003% of Co can be provided. As no lead and silver is contained, the solder alloy is more environment-friendly, and has the advantages of low cost, good mechanical performance, high tensile strength, good ductility, creep resistance, high solderability and high impact resistance; and a tin slag phenomenon dose not occur when the operating temperature is about 500 DEG C.

Description

technical field [0001] The invention relates to a solder, in particular to a SnCuNiGaGeIn-based silver-free lead-free solder alloy, which belongs to the technical field of soldering materials. Background technique [0002] With the rapid development of the electronics industry, the requirements for electronic products are getting higher and higher. There are many types of solder used in electronic products, but most of them still use Sn-Pb solder alloys. Because the lead in tin-lead solder pollutes the environment, and Harmful to the human body, the use of leaded solder has long been banned in most countries. Most of the existing lead-free solders are Sn-Ag, Sn-Cu, Sn-Ag alloys, Sn-Ag-Cu, etc. The disadvantages are that some have higher melting points and some have higher costs, such as Ag used in solder. Excessive elements will greatly increase the cost of production, and at the same time, the performance in terms of wettability is also poor. Silver-free and lead-free sol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 余洪桂黄玲霞吴芝锭刘婷
Owner 上海一远电子科技有限公司
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