Semiconductor chip and manufacturing method thereof
A semiconductor and wafer technology, applied in the field of semiconductor wafers and their preparation, can solve the problems of affecting the shape of a columnar semiconductor structure, affecting the withstand voltage characteristics and reliability of the wafer, etc., and achieve the effects of compact product structure, reduced production cost, and simple production process
Inactive Publication Date: 2013-04-03
朱江 +1
5 Cites 2 Cited by
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Abstract
The invention discloses a semiconductor chip with an ultra-junction structure, and a manufacturing method thereof. Manufacturing of an apparatus can be achieved by fewer secondary photoetching technologies and dry etching techniques. Even impurity concentration distribution in good columnar P-type semiconductor and N-type semiconductor areas and vertical direction can be achieved, and reverse voltage endurance of the chip and the reliability of the apparatus are improved.
Application Domain
Semiconductor/solid-state device manufacturingSemiconductor devices
Technology Topic
VoltageDry etching +2
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