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Water-cooled heat sink and production method thereof

A water-cooled radiator and spoiler technology, which is applied in the field of preparation of the water-cooled radiator, can solve problems such as damage, chip temperature rise, chip temperature exceeding, etc., to achieve enhanced turbulence effect, improved processing technology, and enhanced heat transfer Effect

Inactive Publication Date: 2013-04-03
GUANGZHOU GOALAND ENERGY CONSERVATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat generated by the operation of high-power semiconductor devices will lead to an increase in the temperature of the chip. If there are no proper heat dissipation measures, the temperature of the chip may exceed the maximum allowable junction temperature, resulting in deterioration of device performance and even damage
The existing water-cooled radiator with cover plate structure includes a main board and a cover plate. There are water channels on the main board. The shape of the cover plate is the same as that of the water channel. The cover plate is welded to the main board. Relatively complicated, resulting in poor heat dissipation performance of the water-cooled radiator

Method used

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  • Water-cooled heat sink and production method thereof
  • Water-cooled heat sink and production method thereof

Examples

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Embodiment 1

[0022] Such as figure 1 As shown, a water-cooled radiator includes a substrate 1, a plug 2, a joint 3-1, a joint 3-2, a set screw 4, a spoiler 5, an O-ring 6-1 and an O-ring 6 -2, as in figure 2 As shown, the inside of the substrate 1 is processed with horizontally and vertically staggered holes 1-1, the inner holes 1-1 of the substrate 1 cooperate with the plugs 2 and the set screws 4 through threads 1-2, and the inner holes 1-1 of the substrate 1 It becomes a serpentine flow channel with an inlet and an outlet. The inlet is equipped with an O-ring 6-1 and a joint 3-1, and the outlet is equipped with an O-ring 6-2 and a joint 3-2. The inlet and outlet are on the same side , a helical spring is fixed in the serpentine flow channel as a spoiler 5 .

Embodiment 2

[0024] The preparation method of the water-cooled radiator described in embodiment 1 comprises the following steps:

[0025] (1) Drill horizontally and vertically staggered holes 1-1 from the periphery of the substrate 1 to the inside, and tap threads 1-2, holes 1-1 and threads 1-2 such as figure 2 shown;

[0026] (2) Closely match the plug 3 and the locking screw 4 with the thread 1-2 to obtain a serpentine flow channel with an inlet 1-3 and an outlet 1-4;

[0027] (3) Install an O-ring 6-1 and a joint 3-1 at the inlet 1-3, and install an O-ring 6-2 and a joint 3-2 at the outlet 1-4.

[0028] In order to better realize the present invention, the preparation method of the water-cooled radiator further includes fixing a spoiler 5 in the tunnel 1-1.

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Abstract

The invention discloses a water-cooled heat sink which comprises a substrate, plugs, connectors and set screws, wherein the inside of the substrate is processed with staggered pore channels, the pore channels in the substrate, the plugs and the set screws mach with one another closely through threads, and the pore channels in the substrate are snakelike flow channels with inlets and outlets which are provided with the connectors. The production method includes that (1) the staggered pore channels are formed from the periphery to the inside of the substrate, (2) the plugs and the set screws closely mach with the pore channels in the substrate through threads and the pore channels in the substrate are formed to be the snakelike flow channels with the inlets and the outlets, and (3) the inlets and the outlets are provided with the connectors. The structure of the water-cooled heat sink is simple that the pores are directly formed on the aluminum plate before some of flow channels are sealed to form the snakelike flow channels. The water-cooled heat sink improves the processing technology to enhance heat transfer and has a turbulator which further strengthens the turbulent flow effect to have small temperature differences between the plate temperatures of the inlet portion and the outlet portion to avoid affecting the normal operation of power electronic devices.

Description

technical field [0001] The invention relates to a water-cooled radiator, and also relates to a preparation method of the water-cooled radiator. Background technique [0002] With the development of electronic technology, the performance of electronic equipment has improved rapidly, and the power dissipation of the entire system has also increased sharply. The increase of power dissipation and the requirement of miniaturization lead to the increasingly prominent problem of heat dissipation. If this problem cannot be solved well, it will not only affect the performance of the equipment, but also shorten the life of the equipment. Research has shown that among the many factors that affect the reliability of electronic devices, heat dissipation is critical. The heat generated by the operation of high-power semiconductor devices will cause the temperature of the chip to rise. If there are no proper heat dissipation measures, the temperature of the chip may exceed the maximum all...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 文玉良唐洪冷明全李建军
Owner GUANGZHOU GOALAND ENERGY CONSERVATION TECH