Aluminum substrate layer material of copper-aluminum composite metal strip, strip and machining method thereof
A copper-aluminum composite board and copper-aluminum composite technology, which is applied in the field of material processing, can solve the problems of copper-aluminum composite row bonding strength and bending performance that cannot meet actual needs, and achieve improved machining performance, high material hardness, and suppression of abnormalities Effect
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Embodiment 1
[0034] The aluminum matrix layer material of the copper-aluminum composite metal plate of this embodiment is composed of the following mass fractions: Si0.08%, Fe1.2%, Cu0.1%, Mn0.2%, Ti0.02 %, the balance is Al.
[0035] The copper-aluminum composite metal strip of this embodiment includes an aluminum base layer and a copper covering layer, the aluminum base layer is composed of the aluminum base layer material of this embodiment, the copper covering layer is composed of a copper covering layer material, and the grade of the copper covering layer material is TU2 , the state is TM. A copper cladding layer overlies the upper surface of the aluminum base layer.
[0036] The processing method of the copper-aluminum composite metal strip of the present embodiment comprises the following steps:
[0037] 1) Material preparation:
[0038] a) Measure the components of the aluminum matrix layer material according to the formula, first melt the aluminum ingot at 770 ° C, then add Si,...
Embodiment 2
[0050] The copper-aluminum composite metal strip material of this embodiment includes an aluminum matrix layer material and a copper covering layer material, and the aluminum matrix layer material is composed of the following mass fractions: Si0.04%, Fe0.5%, Cu0.4%, Mn2.0%, Ti0.03%, and the balance is Al.
[0051] The copper-aluminum composite metal strip of this embodiment includes an aluminum base layer and a copper covering layer, the aluminum base layer is composed of the aluminum base layer material of this embodiment, the copper covering layer is composed of a copper covering layer material, and the grade of the copper covering layer material is TU2 , the state is TM. A copper cladding layer overlies the lower surface of the aluminum base layer.
[0052] The processing method of the copper-aluminum composite metal strip of the present embodiment comprises the following steps:
[0053] 1) Material preparation:
[0054] a) Measure the components of the aluminum matrix l...
Embodiment 3
[0066] The copper-aluminum composite metal strip material of this embodiment includes an aluminum matrix layer material and a copper covering layer material, and the aluminum matrix layer material is composed of the following mass fractions: Si0.06%, Fe0.85%, Cu0.25%, Mn1.1%, Ti0.025%, and the balance is Al.
[0067] The copper-aluminum composite metal strip of this embodiment includes an aluminum base layer and a copper covering layer, the aluminum base layer is composed of the aluminum base layer material of this embodiment, the copper covering layer is composed of a copper covering layer material, and the grade of the copper covering layer material is TU2 , the state is TM. A copper cladding layer covers the upper and lower surfaces of the aluminum base layer.
[0068] The processing method of the copper-aluminum composite metal strip of the present embodiment comprises the following steps:
[0069] 1) Material preparation:
[0070] a) Measure the components of the alumi...
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