Printed wiring board forming method
A printed circuit board and circuit technology, which is applied in the directions of printed circuits, the formation of electrical connections of printed components, and the manufacture of printed circuits, can solve the problems of complex gold finger technology and achieve the effect of simple technology
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no. 1 example
[0034] The method for forming a printed wiring board provided in the first embodiment of the present invention includes: providing a printed wiring board, the printed wiring board includes a substrate, a window area and a wiring area surrounding the window area are formed on the substrate, and the printed wiring board includes: A circuit is formed on the surface of the circuit area, and one end of the circuit has a gold finger connected to the window area; the window area of the printed circuit board is milled to form a hollow chip window.
[0035] refer to figure 1 A printed wiring board 10 is provided, the printed wiring board 10 includes a substrate 110, a window area A and a circuit area B surrounding the window area A are formed on the substrate 110; lines (not shown) are formed on the surface of the circuit area B shown), the circuit has a gold finger (not shown) connected to the window area A, the gold finger plating lead is formed on the surface of the window area A,...
no. 2 example
[0051] Such as Figure 5 As shown, the difference between this embodiment and the first embodiment is that in this embodiment, before milling, a dry film 200 is pasted on the surface of the circuit, and then milling is performed to form the gold finger end surface 140 .
[0052] In this embodiment, the selected dry film 200 is the RistonRPM100 series dry film of DuPont. The RistonRPM100 series dry film is a dry film based on electroplating, which is suitable for various copper surfaces. It is not easy to drop the film, and can be used for nickel / gold plating.
[0053] After the dry film 200 is pasted on the circuit surface, in order to remove the air bubbles between the dry film 200 and the circuit, and strengthen the bonding between the film and the circuit, after pasting the dry film, it also includes placing the printed circuit board in a vacuum chamber , for vacuum treatment.
[0054] As an embodiment, after pasting the dry film 200 on the surface of the circuit, in orde...
no. 3 example
[0056] Such as Figure 6 As shown, the difference between the third embodiment of the present invention and the second embodiment and the first embodiment is that in the third embodiment, the liner 300 is bonded on the surface of the substrate 110 away from the circuit first, and then milling is performed. The backing board 300 is a phenolic backing board or a melamine backing board. As an example, pins are used to align and fix the liner 300 and the base plate 110 first, then tape is used to fix them, and then the base plate 110 and the liner 300 are combined by heating.
[0057] As mentioned above, during milling, the substrate 110 will give a support force to the circuit, and the direction of the support force is opposite to the milling direction, so it can offset to a certain extent the generation of the golden finger 130 during the milling process. The elastic force along the milling direction can reduce or avoid the burr generated on the gold finger end surface 140 prod...
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