Heat insulating material and its manufacturing method
A thermal insulation material and thermal conductivity technology, which is applied in the field of thermal insulation materials and thermal insulation material manufacturing, can solve the problems of low thermal conductivity thermal insulation materials and low thermal conductivity, and achieve the effect of not being easy to collapse and deform
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0245] A hammer mill is used to obtain a silica powder in which 25% by mass of silica powder (small particles) with an average particle size of 14nm and 75% by mass of silica powder (large particles) with an average particle size of 150nm are uniformly mixed. body. To obtain a length of 30cm, a width of 30cm, a thickness of 20mm, and a bulk density of 0.50g / cm 3 In the form of a molded body, 900 g of silica powder was filled in a mold with an internal dimension of 30 cm in length and 30 cm in width, and then subjected to pressure molding. As a result, the bulk density was 0.50 g / cm 3 的形体。 The shaped body. This molded body was heat-treated at 900° C. for 5 hours, and used as the heat insulating material of Example 1. Such as [small particle size D S As described in the measurement], the cross-section of the heat insulating material of Example 1 was observed, and as a result, it was confirmed that there were two or more particles with an equivalent circle equivalent diameter of 5...
Embodiment 2
[0247] A hammer mill is used to obtain a silica powder in which 15% by mass of silica powder (small particles) with an average particle diameter of 12 nm and 85% by mass of silica powder (large particles) with an average particle diameter of 10 μm are uniformly mixed. body. Using 1980 g of this silica powder, pressure molding was performed in the same manner as in Example 1 to obtain a molded body, and then heat treatment was performed at 1000° C. for 10 hours to obtain a heat insulating material of Example 2. Such as [small particle size D S As described in the measurement], the cross-section of the heat insulating material of Example 2 was observed, and as a result, it was confirmed that there were two or more particles with an equivalent circle equivalent diameter of 5 nm or more and 30 nm or less. Next, change the field of view as necessary, measure the particle size of a total of 100 small particles, and perform a number average. As a result, D S The thickness is 19nm and ...
Embodiment 3
[0249] Obtained by using a hammer mill to uniformly mix 90% by mass of silica powder (small particles) with an average particle size of 7.5nm and 10% by mass of silica powder (large particles) with an average particle size of 60μm. Powder. Using 396 g of this silica powder, pressure molding was performed in the same manner as in Example 1 to obtain a molded body, and then heat treatment was performed at 900° C. for 5 hours to obtain a heat insulating material of Example 3. The cross-section of the heat insulating material of Example 3 was observed as described in [Measurement of Particle Size DS of Small Particles], and as a result, it was confirmed that there were two or more particles having an equivalent circle equivalent diameter of 5 nm or more and 30 nm or less. Next, observe multiple fields of view as needed, measure the particle size of a total of 100 small particles, and average the numbers. As a result, D S It is 9nm and the thermal conductivity at 30°C is 0.0331W / m·K...
PUM
| Property | Measurement | Unit |
|---|---|---|
| particle diameter | aaaaa | aaaaa |
| density | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 