High-color-rendering high-power LED (light emitting diode) encapsulation structure and manufacture method of high-color-rendering high-power LED encapsulation structure

An LED packaging, high-power technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of poor heat conduction and heat dissipation, inability to adjust the light angle, and reduce the speed of heat dissipation, and achieve excellent heat conduction and heat dissipation. Heat dissipation performance improvement, the effect of improving heat dissipation performance

CN103050606AInactive Publication Date: 2013-04-17SOUTH CHINA NORMAL UNIVERSITY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2013-04-17
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a high-color-rendering high-power LED (light emitting diode) encapsulation structure and a manufacture method of the high-color-rendering high-power LED encapsulation structure. The high-color-rendering high-power LED encapsulation structure comprises a high-heat-conduction base plate, a high-heat-conduction material block, a high-power LED chip and an encapsulation assembly, wherein a blind hole is arranged in the high-heat-conduction base plate, the high-heat-conduction material block is arranged in the blind hole and is glued into a whole with the high-heat-conduction base plate through high-heat-conduction bonding agents. The high-color-rendering high-power LED encapsulation structure and the manufacture method have the advantages that the structure that the high-heat-conduction base plate and the high-heat-conduction material block which is arranged in the blind hole of the high-heat-conduction base plate and is tightly matched with the high-heat-conduction base jointly form a high-power LED chip heat radiation base is adopted, the whole heat conduction and heat radiation performance of the heat radiation base is excellent, and heat generated by the high-power LED chip can be fast conducted out of the work region and is radiated through the heat radiation base, so the temperature can be effectively lowered, the stability and the reliability of the high-power LED chip are greatly enhanced, the high-power LED chip can continuously work for a long time at high current, and the service life is long.
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Description

technical field

[0001] The invention relates to the technical field of high-power LED lighting, in particular to a high-color rendering index high-power LED packaging structure and a manufacturing method thereof. Background technique

[0002] LED is a kind of light-emitting device that can directly convert electric energy into visible light and radiant energy. , stable and reliable performance, light weight, small size, low cost and many other advantages, it has been more and more widely used in lighting and decorative lamps and other fields.

[0003] At present, the commonly used high-power white LED is mainly realized by coating phosphor powder on the blue LED chip, but it is difficult to control the coating thickness and shape of the phosphor powder in this packaging process, resulting in uneven color temperature of the LED device, and even The angular color temperature difference of a single LED can be as large as 800K, while the color temperature difference that human ...

Examples

Embodiment Construction

[0025] Such as figure 1As shown, the high color rendering index high-power LED packaging structure of the present invention includes a high thermal conductivity substrate 1, a high heat dissipation material block 2, a high-power LED chip 3 and a package assembly 4, wherein the high thermal conductivity substrate 1 is provided with Blind hole 11, the high heat dissipation material block 2 is installed in the blind hole 11 and bonded with the high thermal conductivity substrate 1 through the high thermal conductivity adhesive 5, and the high power LED chip 3 is attached to the high heat dissipation material block 2 on. Wherein, the blind hole 11 provided on the above-mentioned high thermal conductivity substrate 1 is an inverted trapezoid, the bottom surface and the side surface of the inverted trapezoid blind hole 11 are flat and smooth, and the shape of the above-mentioned high heat dissipation material block 2 is the lower half of the inverted trapezoid blind hole 11. It is ...