High-color-rendering high-power LED (light emitting diode) encapsulation structure and manufacture method of high-color-rendering high-power LED encapsulation structure

Abstract

The invention relates to a high-color-rendering high-power LED (light emitting diode) encapsulation structure and a manufacture method of the high-color-rendering high-power LED encapsulation structure. The high-color-rendering high-power LED encapsulation structure comprises a high-heat-conduction base plate, a high-heat-conduction material block, a high-power LED chip and an encapsulation assembly, wherein a blind hole is arranged in the high-heat-conduction base plate, the high-heat-conduction material block is arranged in the blind hole and is glued into a whole with the high-heat-conduction base plate through high-heat-conduction bonding agents. The high-color-rendering high-power LED encapsulation structure and the manufacture method have the advantages that the structure that the high-heat-conduction base plate and the high-heat-conduction material block which is arranged in the blind hole of the high-heat-conduction base plate and is tightly matched with the high-heat-conduction base jointly form a high-power LED chip heat radiation base is adopted, the whole heat conduction and heat radiation performance of the heat radiation base is excellent, and heat generated by the high-power LED chip can be fast conducted out of the work region and is radiated through the heat radiation base, so the temperature can be effectively lowered, the stability and the reliability of the high-power LED chip are greatly enhanced, the high-power LED chip can continuously work for a long time at high current, and the service life is long.

Description

technical field [0001] The invention relates to the technical field of high-power LED lighting, in particular to a high-color rendering index high-power LED packaging structure and a manufacturing method thereof. Background technique [0002] LED is a kind of light-emitting device that can directly convert electric energy into visible light and radiant energy. , stable and reliable performance, light weight, small size, low cost and many other advantages, it has been more and more widely used in lighting and decorative lamps and other fields. [0003] At present, the commonly used high-power white LED is mainly realized by coating phosphor powder on the blue LED chip, but it is difficult to control the coating thickness and shape of the phosphor powder in this packaging process, resulting in uneven color temperature of the LED device, and even The angular color temperature difference of a single LED can be as large as 800K, while the color temperature difference that human ...

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Problems solved by technology

[0006] The Chinese patent with the patent number ZL201020165179.3 discloses "an LED packaging structure". The substrate used in the packaging structure is a BT board, and the BT board is also called a BT resin-based copper clad laminate, that is, a layer of copper is covered on the resin as a circuit. , the resin is used for heat dissipation, and the copper is covered as a circuit. Its thermal conductivity is about 16.5W / mK, and the thermal conductivity and heat dissipation effect are poor; It is 397W / mK, and the thermal conductivity of ceramics is about 319W / mK, so its heat conduction and heat dissipation effects are also poor; the LED chip fixing and protection material used in this packaging structure is high-temperature glue, which can also be used as heat dissipation for the LED chip material, but the high-temperature adhesive cannot adjust the light angle and improve the light output efficiency; the packaging structure uses a high thermal conductivity material embedded in the through hole. The BT board is originally very thin, resulting in a relatively small contact area between the high thermal conductivity material and the BT board. LED It is difficult for the heat transferred from the chip to the high thermal conductivity material to be dissipated efficiently on the BT board, and it is difficult to completely match the shape of the through hole with the high thermal conductivity material, which further reduces the heat conduction, so the high thermal conductivity material The heat can only be transferred to the air with the largest contact area, resulting in a small heat dissipation effect of the substrate, which greatly reduces the heat dissipation speed

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