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Manufacturing method of blind hole of flexible printed circuit board

A technology of flexible printed circuit and manufacturing method, which is applied in the direction of electrical connection and formation of printed components, can solve the problems of low efficiency, high cost, unfavorable copper plating on hole walls, etc., and achieve the effect of high efficiency and low cost

Active Publication Date: 2016-08-10
吉安新宇腾跃电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because this method needs to cut the copper clad layer on the surface of the substrate first, the efficiency is low and the cost is high. At the same time, the hole shape cannot be guaranteed to be an isosceles trapezoidal shape, which is not conducive to the subsequent process of electroplating copper on the hole wall.

Method used

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  • Manufacturing method of blind hole of flexible printed circuit board
  • Manufacturing method of blind hole of flexible printed circuit board
  • Manufacturing method of blind hole of flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Example 1, the thickness of the PI layer is 21.1 μm, and the dry film hot pressing pressure is 4Kg / cm 2 , speed 1m / min, roller temperature 112°C; blind hole diameter 111.6um, exposure energy 60j / cm 2 , developer NaCO 3 The volume concentration of the solution is 1.1%, and the developing speed is 2.2m / min; the volume concentration of the etching solution is 31% HCl, 21% NaClO 3 , Cu 2+ Content 160g / L, acidity 2.0N, temperature 52°C, speed 2.8m / min, NaOH solution volume concentration 4% during stripping, temperature 55°C, speed 1.8m / min; laser drilling frequency 100Hz for the first time , energy 9mj, pulse width 11ms, second punching frequency 100Hz, energy 3mj, pulse width 4ms. like Figure 4 As shown, the MR-2 metallographic slice tester produced by Dongguan Yuanqing Electronics Co., Ltd. is used for testing, and the trapezoidal blind hole shape is standardized.

Embodiment 2

[0034] Example 2, the thickness of the PI layer is 20.8 μm, and the hot pressing pressure of the dry film is 5Kg / cm 2 , speed 1.4m / min, roller temperature 120°C; blind hole diameter 114.2um, exposure energy 70j / cm 2 , developer NaCO 3 The volume concentration of the solution is 0.8%, and the developing speed is 0.8m / min; the volume concentration of the etching solution is 35% HCl, 25% NaClO 3 , Cu 2+Content 190g / L, acidity 3.0N, temperature 45°C, speed 3.0m / min, NaOH solution volume concentration 6% during stripping, temperature 52°C, speed 2.2m / min; laser drilling frequency 100Hz for the first time , energy 9mj, pulse width 11ms, second punching frequency 100Hz, energy 3mj, pulse width 4ms.

Embodiment 3

[0035] Example 3, the thickness of the PI layer is 20.5 μm, and the dry film hot pressing pressure is 4Kg / cm 2 , speed 1m / min, roller temperature 112°C; blind hole diameter 110.5um, exposure energy 60j / cm 2 , developer NaCO 3 The volume concentration of the solution is 1.1%, and the developing speed is 2.5m / min; the volume concentration of the etching solution is 28% HCl, 15% NaClO 3 , Cu 2+ Content 120g / L, acidity 1.0N, temperature 55°C, speed 2.5m / min, NaOH solution volume concentration 7% during stripping, temperature 45°C, speed 1.6m / min; laser drilling frequency 100Hz for the first time , energy 9mj, pulse width 11ms, second punching frequency 100Hz, energy 3mj, pulse width 4ms.

[0036] The manufacturing method of the blind hole of the flexible printed circuit board of the present invention can obtain the blind hole of ideal shape, has high drilling efficiency, simple process, easy control and low cost.

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Abstract

The invention discloses a manufacture method of a flexible printed circuit board blind hole. The technical problems to be solved are to improve the efficiency of machining the blind hole and lower the cost. The manufacture method comprises the following steps: a dry film is pasted on a copper-clad surface of a base material for the purposes of exposure and development, and a copper-clad layer of a round hole is enabled to be exposed; the exposed copper-clad layer is placed in etching liquid to be wiped off, and a polyimide layer is enabled to be exposed; a laser device is adopted to punch holes; for the first time, the polyimide layer is punched with the holes, the frequency is 100-150 hertz, the energy is 8-14 megajoules, and the pulse width is 10-11 milliseconds; for the second time, an original hole site of the polyimide layer is punched with the holes, the adopted frequency is 90-100 hertz, the energy is 3-4 megajoules, and the pulse width is 4-5 milliseconds, and then the flexible printed circuit board blind hole is obtained. According to the manufacture method of the flexible printed circuit board blind hole, compared with the prior art, a flexible printed circuit board base material is etched with a copper-clad layer window. Lasers are exerted to punch the holes in inter-layer polyimide, the copper-clad layer on the bottom surface is exposed, and the blind hole with a normative shape is formed. The manufacture method of the flexible printed circuit board blind hole is high in efficiency and low in cost.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for manufacturing a flexible printed circuit board. Background of the invention [0002] Nowadays, the circuit conduction between the layers of the printed circuit board is mainly realized through metallized through holes, and the hole diameter is greater than or equal to 0.2mm. With the rapid development of communication electronic equipment, the wiring requirements for printed circuit boards used in them are getting higher and higher, the lines are thinner, and the line spacing is smaller. Making large through holes cannot meet the wiring requirements, and the hole diameter is less than or equal to 0.15mm. The circuit conduction methods of microvias and blind holes came into being, among which blind holes are applied to high-density interconnection printed circuit boards, which have also had a significant impact and promotion on the flexible printed...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40
Inventor 陈小龙郑意
Owner 吉安新宇腾跃电子有限公司