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Thermosetting Resin Filling Material

A filling material and thermosetting technology, which is applied in the manufacture of printed circuits, electrical components, and printed circuits. It can solve the problems of difficulty in forming flat plating, poor patterning, and influence, and achieves suppression of deterioration over time and excellent shape retention. Effect

Active Publication Date: 2015-11-25
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In this way, the hole portion of the printed circuit board is filled, and the protruding resin composition causes sagging on the surface of the printed circuit board, so there are problems such as grinding of the conductive layer during polishing, and generation of depressions on the through hole resulting in flatness. Difficulty in forming the plating cover, poor patterning caused by resin residue on the conductive layer, etc. affect the electrical characteristics and reliability of the printed circuit board

Method used

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  • Thermosetting Resin Filling Material
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  • Thermosetting Resin Filling Material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0064] Hereinafter, the present embodiment will be specifically described by showing examples and comparative examples. It should be noted that the following "parts" and "%" are all quality standards unless otherwise specified.

[0065] (preparation of paste)

[0066] After the components shown in Table 1 were premixed with a mixer in their respective compounding ratios (parts by mass), they were dispersed with a three-roll mill to prepare thermosetting resin fillers of Examples 1 to 8 and Comparative Examples 1 to 3. paste.

[0067] [Table 1]

[0068]

[0069] *1: 828 (manufactured by Mitsubishi Chemical Corporation)

[0070] *2: 807 (manufactured by Mitsubishi Chemical Corporation)

[0071] *3: p-aminophenol type epoxy resin jER-630 (manufactured by Mitsubishi Chemical Corporation)

[0072] *4: 2MZ-A (manufactured by Shikoku Chemicals Co., Ltd.)

[0073] *5: SO-C5 (manufactured by ADMATECHS CO.,LTD.)

[0074] *6: SOFTON1800 (manufactured by BIHOKUFUNKAKOGYOCO.,LTD....

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Abstract

Provided is a heat-curable resin filler in which the deterioration in thixotropic properties over time can be prevented and which has excellent shape retaining properties after being filled in hole parts in a printed wiring board and being cured and also has excellent abradability. The heat-curable resin filler comprises an epoxy resin, an epoxy resin curing agent, an inorganic filler and a fatty acid represented by the following general formula: (R1COO)n-R2 (wherein the substituent R1 represents a hydrocarbon group having 5 or more carbon atoms; the substituent R2 represents a hydrogen atom, an metal alkoxide group or a metal atom; and n is 1 to 4).

Description

technical field [0001] The present invention relates to a thermosetting resin filling material used, for example, for hole filling of printed circuit boards and the like. Background technique [0002] In recent years, along with miniaturization and higher functionality of electronic equipment, miniaturization of patterns of printed circuit boards, reduction of mounting area, and higher density of component mounting are required. Therefore, multilayer substrates such as build-up circuit boards are used in which an insulating layer and a conductor circuit are sequentially formed on a core material on a double-sided substrate provided with through holes, and interlayer connections are made through via holes or the like. Furthermore, area array packages such as BGA (Ball Grid Array) and LGA (Line Array) are performed. [0003] In such a printed circuit board, a conductive layer is formed on the surface and the inner walls of through holes such as through holes and via holes, an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K5/09C08K5/10C08K9/04H05K3/28
CPCC08K5/09C08K3/0033C08K5/098C08L63/00H05K1/032H05K3/0094H05K2201/0209H05K2201/0959H05K2203/025H05K2203/122C08K3/013C08K9/04H05K3/28
Inventor 远藤新
Owner TAIYO HLDG CO LTD
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