Organic light-emitting diode (OLED) panel packaging structure and packaging method

Abstract

The invention provides an organic light-emitting diode (OLED) panel packaging structure and a packaging method for forming the packaging structure. The packaging structure comprises a base plate, a connecting electrode, an OLED, a cover plate and a glass wall. The glass wall is in a shape of a closed loop, and forms a closed cavity together with the base plate and the cover plate. The packaging method for forming the packaging structure comprises two steps of manufacturing the glass wall and aligning to bond. The invention has the beneficial effects that the cover plate can not easily contact with the OLED as the cover plate is stressed to deform, so that the OLED is effectively prevented from being damaged; meanwhile, after the glass wall is directly doped, the sealing reliability can be further enhanced by using the structure of the glass wall bonded with the base plate and the cover plate; and meanwhile the whole glass wall is doped, so that the phenomenon that fissures are generated caused by a temperature difference stress during an ordinary bonding procedure is prevented. The packaging structure is especially suitable for packaging OLED devices with large sizes, and the reliability in use of the OLED is improved.

Description

technical field [0001] The invention belongs to the technical field of organic light-emitting diode (OLED) display, relates to OLED packaging, and in particular to a packaging structure and packaging method of a large-sized OLED panel. Background technique [0002] Organic light-emitting diode (OLED) display is considered to be the next-generation flat panel display due to its all-solid-state, active light-emitting, high brightness, high contrast, ultra-thin and ultra-light, low power consumption, no viewing angle limitation, and wide operating temperature range. Display emerging application technology. However, part of the structure of OLED displays, especially the electrodes and organic materials located therein, are extremely sensitive to external environmental factors such as oxygen and moisture. In actual use, the device needs to be packaged to isolate the device from water vapor and oxygen to prolong the life of OLED Service life, if the packaging is not good, the com...

AI Technical Summary

Problems solved by technology

[0006] The present invention is aimed at the existing OLED panel packaging structure and is applied to the package cover plate and / or substrate existing in the package of a large-area display panel (not less than 10 inches), when it is squeezed by external force or deformed by its own gravity, the organic light-emitting diode and / or the substrate will be crushed. Or the problem of connecting electrodes, a packaging structure of OLED panel and a packaging method for forming the packaging structure are proposed

Images