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LED package structure for enhancing mixed light effect

An improved structure and diode technology, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of complicated manufacturing process of packaging structure, reduced light extraction efficiency of phosphor powder, poor light extraction efficiency, etc., to improve color rendering , Improved light mixing effect, low power consumption

Inactive Publication Date: 2013-05-15
UNITY OPTO TECH CO LTD
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

Since the luminous efficiency of red light is relatively low among the three-color light-emitting diodes, and because it cannot excite the phosphor powder, it is blocked by the phosphor powder and reduces its light extraction efficiency, which makes the light extraction efficiency of this light-emitting diode poor. , just like the light-emitting diode structure design of the announcement number M380580, to improve the light extraction efficiency, but the manufacturing process of this packaging structure is complicated, which greatly increases the cost and is not conducive to mass production.

Method used

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  • LED package structure for enhancing mixed light effect
  • LED package structure for enhancing mixed light effect
  • LED package structure for enhancing mixed light effect

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Embodiment Construction

[0019] In order to enable your examiners to clearly understand the content of the present invention, the following descriptions are provided together with the accompanying drawings, please refer to them.

[0020] see figure 1 , is a sectional state diagram (1) of a preferred embodiment of the present invention. As shown in the figure, the improved white light diode packaging structure 1 for enhancing the light mixing effect of the present invention includes at least one first light-emitting chip 10 and at least one second light-emitting chip 12, and these two kinds of light-emitting chips are respectively arranged in a The bottom of a first accommodating portion 140 and a second accommodating portion 142 in the support structure 14, the first accommodating portion 140 is a cup-shaped structure with a narrow bottom and a wide top, for setting the first light-emitting chip 10, The second accommodating portion 142 is a cup-shaped structure with a narrow bottom and a wide top for...

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Abstract

An LED package structure for enhancing mixed light effect comprises: at least one first light emitting chip; at least one second light emitting chip, a frame structure having a first containing portion, a second containing portion, a spacing portion and a light mixing area; a first colloid, doped with a green-light phosphor and filled into the first containing portion; a second colloid, filled into the second containing portion; and an encapsulating colloid, packaged and filled into the light mixing area. This design can enhance the light emission efficiency and achieve a uniform light-mixing dot light source.

Description

technical field [0001] The present invention relates to a light-emitting diode structure, especially a light source part with a wavelength of 400nm-500nm converted into light of 490nm-600nm without affecting the luminous efficiency of a light-emitting diode with a wavelength of 600nm-700nm, and making different wavelengths The improved structure of the white light diode improves the light mixing effect by uniformly mixing the light. Background technique [0002] Light-emitting diodes are widely used as white light backlights in today's life, and white light backlights are mainly formed by mixing light with R, G, and B three-color light-emitting diodes and packaging complementary color phosphors (phosphors). Due to the high cost of light mixing of R, G, and B three-color light-emitting diodes, and the excitation of multi-color phosphors by ultraviolet light, the luminescence stability is poor, the light decay is large, and there are doubts about health effects. Cheaper and mo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50H01L33/54
CPCH01L2933/0091H01L2224/48091H01L2224/8592H01L33/50H01L25/0753H01L33/56H01L2924/3025H01L2924/181H01L24/48H01L2224/48105H01L2224/48227H01L2924/12041H01L2924/00014H01L2924/00H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207
Inventor 吴秉宸路洹瀛沈士超
Owner UNITY OPTO TECH CO LTD