Method for applying laser drilling to sapphire slice drilling

A laser drilling and sapphire technology, applied in laser welding equipment, welding equipment, metal processing equipment and other directions, can solve the problems of difficulty in drilling and processing, and achieve the effects of fast speed, difficulty overcoming, and high efficiency

Inactive Publication Date: 2013-05-22
无锡鼎晶光电科技有限公司
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Problems solved by technology

[0008] In order to solve the above-mentioned technical problems, the purpose of the present invention is to provide a method for applying

Method used

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  • Method for applying laser drilling to sapphire slice drilling

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Example Embodiment

[0037] The specific embodiments of the present invention will be described in further detail below in conjunction with the drawings and embodiments. The following examples are used to illustrate the present invention, but not to limit the scope of the present invention.

[0038] Such as figure 1 As shown, a method for applying laser perforation to perforating a sapphire sheet includes the following steps:

[0039] S1: Fix the sapphire sheet on the worktable 1 of the laser device (the workbench 1 has a table 2 holding the sapphire sheet), and align the laser emitting head 4 of the laser device at the pre-drilled position of the sapphire sheet;

[0040] S2: Set the parameters of the laser device according to the thickness of the sapphire sheet. This step can be divided into 5 steps:

[0041] a: According to the thickness and formula of the sapphire sheet Set the parameters of the laser equipment;

[0042] E=1.6sqrH

[0043] Where: E-energy, unit: Joule, H-sapphire sheet thickness, unit...

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Abstract

The invention relates to a method for applying laser drilling to sapphire slice drilling. The method comprises a first step of fixing a sapphire slice on an operating platform of a laser device and enabling a laser emission head of the laser device to be aligned to a position to be drilled on the sapphire slice, a second step of setting parameters of the laser device according to the thickness of the sapphire slice, and a third step of starting the laser device to enable the laser device to emit laser beams towards the position to be drilled on the sapphire slice, wherein the second step comprises a first step of setting parameters of the laser device according to the thickness of the sapphire slice and a formula (1), a second step of determining laser emission frequency of the parameters of the laser device according to determined energy in the parameters of the laser device and a formula (2), a third step of determining feed rate of the parameters of the laser device according to determined laser emission frequency of the parameters of the laser device and a formula (3), a fourth step of setting 0.3-0.5 ms as the wave width of the parameters of the laser device, and a fifth step of adjusting Hgt% of the parameters of the laser device to enable average power of the laser device to be 255 W.

Description

technical field [0001] The invention relates to a method for applying laser drilling to the drilling of sapphire sheets. Background technique [0002] Laser drilling is the earliest practical laser processing technology, and it is also one of the main application fields of laser processing. With the rapid development of modern industry and science and technology, more and more materials with high hardness and high melting point are used, while traditional processing methods can no longer meet certain process requirements. Existing sapphire sheets are mainly punched by engraving machines. The so-called engraving machines refer to CNC milling machines that use small tools, high power and high-speed spindle motors. The existing engraving machines have the following defects: [0003] 1. The high-efficiency processing materials of Jingdiao machine are low-hardness materials such as stainless steel and copper, and the hardness of sapphire is second only to diamonds; Jingdiao cons...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/382
Inventor 张向峰
Owner 无锡鼎晶光电科技有限公司
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