Optical fiber clamping device for packing changeable light attenuator

A clamping device and attenuator technology, applied in the coupling of optical waveguides and other directions, can solve the problem of high cost, reduce the cost of packaging and debugging, ensure the alignment accuracy, and achieve the effect of high packaging efficiency

Inactive Publication Date: 2013-06-12
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the chip packaging process, it needs to be aligned with the optical fiber. For the micromirror array, it is too expensive to implement it manually.

Method used

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  • Optical fiber clamping device for packing changeable light attenuator
  • Optical fiber clamping device for packing changeable light attenuator

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Experimental program
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Embodiment Construction

[0014] The technical solution of the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0015] Such as figure 1 and figure 2 As shown, the optical fiber clamping device for variable optical attenuator packaging of the present invention includes a substrate 1 and a cover plate 5 . n fiber groove groups are etched on the upper part of the substrate 1 . n is an integer greater than or equal to 1. Each fiber groove group consists of a cavity 4 and two fiber grooves 2, the cavity 4 is located at the end of the substrate 1, the inlet ends of the two fiber grooves 2 are located at the end of the substrate 1, and the two fiber grooves 2 The outlet end of the fiber optic groove 2 communicates with the cavity 4, and from the inlet end to the outlet end of the fiber optic groove 2, the two fiber grooves 2 are gradually approached. At the exit end of the fiber grooves 2, the distance between the two fiber grooves 2 is the shor...

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Abstract

The invention discloses an optical fiber clamping device for packing a changeable light attenuator. The optical fiber clamping device comprises a substrate and a cover plate, wherein n optical fiber slot groups are etched in the upper part of the substrate, each optical fiber slot group consists of a cavity and two optical fiber slots, the cavity is arranged in the end part of the substrate, inlet ends of the two optical fiber slots are arranged in the end part of the substrate, the outlet ends of the two optical fiber slots are communicated with the cavity, the two optical fiber slots are gradually approached from the inlet ends to the outlet ends of the optical fiber slots, and on the outlet ends of the optical fiber slots, a distance of the two optical fiber slots is the closest; extending lines of the two optical fiber slot central lines are crossed on the edge of the substrate; n is an integer larger than or equal to 1; and the cover plate is fixedly connected onto a top face of the substrate. A mounting position for an optical fiber is arranged in the optical fiber clamping device, thus one-time alignment assembly of a pair or multiple pairs of optical fibers can be realized, and the packing efficiency is greatly improved.

Description

technical field [0001] The invention relates to an optical fiber clamping device, in particular to an optical fiber clamping device used for packaging a variable optical attenuator. Background technique [0002] Variable optical attenuator (VOA) is an important fiber optic passive device in optical network. It is a key component of optical amplifier and plays a key role in power balance in optical fiber communication system. Micro-Electro-Mechanical Systems (MEMS for short) variable optical attenuator has reliable performance, compact structure, low cost, easy mass production, and has broad development prospects. The current MEMS variable optical attenuator mainly has a micromirror structure, and the up and down deflection of the micromirror is realized through electrostatic drive. The chip packaging process needs to be aligned with the optical fiber, and it is too costly for the micromirror array to be realized manually. Therefore, designing a high-efficiency packaging st...

Claims

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Application Information

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IPC IPC(8): G02B6/26
Inventor秦明
OwnerSOUTHEAST UNIV