Long-contact time micro-electromechanical universal inertia switch and manufacturing method for same

Abstract

The invention provides a long-contact time micro-electromechanical universal inertia switch and a manufacturing method for the same, and aims to solve the problems of capability of capturing inertial acceleration in a single direction only and short contact time of a movable electrode and a fixed electrode of the conventional micro-electromechanical system (MEMS) inertia switch. Key points are that a middle structural layer of a silicon chip comprises an annular mass frame, an annular external electrode and an anchorage area, which are arranged outwards from an anchorage point taken as the center of a circle. The anchorage area and the anchorage point are bonded with a lower cover plate. Four external springs are arranged crosswise. The two ends of each external spring are fixedly arranged between the anchorage area and the annular external electrode respectively. Four internal springs are arranged crosswise. The two ends of each internal spring are fixedly arranged on the annular mass frame and the anchorage point respectively. The inertia switch and the manufacturing method have the positive effects that inertial acceleration in any direction can be captured; and after threshold acceleration is captured, the contact time of the two electrodes is greatly prolonged.

Description

technical field [0001] The present invention relates to micro-control switches, and in particular to micro-electromechanical (MEMS) inertial switches. Background technique [0002] The micro-electromechanical inertia switch is a MEMS actuator that is sensitive to changes in acceleration and provides a switch closing action. It is also called a threshold switch, an acceleration switch or a g-value switch. It is a product that combines mechanics and electricity. MEMS inertial switches are not only small in size, fast in response, and capable of capturing weak signals, but also have good process performance, which is suitable for mass production and reduces processing costs. Micro-electromechanical inertia switch is generally composed of upper substrate (hereinafter referred to as upper cover plate)-silicon wafer intermediate structure layer-lower substrate (hereinafter referred to as lower cover plate) to form a Hamburg structure. The silicon wafer intermediate structural laye...

AI Technical Summary

Problems solved by technology

However, due to the extremely short moment of collision, the contact time between the movable electrode and the fixed electrode is too short. When the working environment is relatively extreme (such as below minus 30 degrees), the circuit cannot be reliably connected.

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