Copper alloy hot-forged part and process for producing copper alloy hot-forged part

Abstract

This copper alloy hot-forged part has an alloy composition which contains 0.21 to 0.44 mass% of Co, 0.06 to 0.13 mass% of P, 0.003 to 0.08 mass% of Sn and 0.00003 to 0.0030 mass% of O, with the balance consisting of Cu and unavoidable impurities, and in which the Co content, [Co] mass%, and the P content, [P] mass%, satisfy the relationship: 3.1 = ([Co] - 0.005) / ([P] - 0.006) = 4.9. In the cross-sectional metal structure, the sum of the fraction of recrystallized-grain groups where the recrystallized grains have an average grain diameter of 0.050 to 0.50mm and the fraction of un-recrystallized grains is 80% or above.

Description

technical field [0001] The invention relates to a copper alloy hot forging and a method for manufacturing the copper alloy hot forging. In particular, it relates to a copper alloy hot forging with excellent strength, endurance, thermal conductivity, electrical conductivity and creep properties and a method for manufacturing the copper alloy hot forging. Background technique [0002] Copper exhibits high thermal conductivity and electrical conductivity, and is used in various industrial fields such as heat sinks, heat sinks, shorting rings, terminals, bases, connectors, electrodes, sensor components, models, and pressure vessels. However, so-called pure copper having a copper concentration of 99.9% or more represented by tough copper, oxygen-free copper, and phosphorus-deoxidized copper has low strength, so in order to ensure strength, the amount of copper used per unit area increases and the cost increases. Volume and weight also become larger. [0003] In addition, with t...

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Problems solved by technology

[0011] However, the copper alloy described in Patent Document 1 requires special solution treatment and has problems such as poor electrical / thermal conductivity

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