Sealing resin composition and electronic component device

Abstract

The sealing resin composition of the present invention comprises a phenolic resin curing agent (A), an epoxy resin (B), and an inorganic filler (C). The phenolic resin curing agent (A) comprises: at least one polymer having a predetermined structure; a polymer component (A-1) containing a structure in which a monovalent hydroxyl phenylene structural unit is linked with a multivalent hydroxyl phenylene structural unit by means of a structural unit containing a biphenylene group; and a polymer component (A-2) containing a structure in which multivalent hydroxyl phenylene structural units are linked by means of a structural unit containing a biphenylene group, wherein the phenolic resin curing agent (A) comprises the polymer component (A-1) and the polymer component (A-2) as essential components and comprises at least a predetermined amount of the polymer component (A-1). It is therefore possible to economically provide a sealing resin composition which has excellent balance in terms of soldering resistance, incombustibility, continuous formability, flow characteristics and high-temperature storage characteristics, and to provide a highly reliable electronic component device which is formed by sealing elements with the cured product of the sealing resin composition.

Description

technical field [0001] The present invention relates to a sealing resin composition and an electronic component device. Background technique [0002] There is no end to the miniaturization, light weight and high performance requirements of electronic equipment. The high integration and high density of components (hereinafter, also referred to as "chips") are developing year by year. In addition, electronic component devices (hereinafter, also referred to as "Package"), surface mount technology has emerged and is gaining popularity. Due to the advancement of the peripheral technology of such electronic component devices, the requirements for the resin composition for sealing the element are also becoming stricter. For example, in the surface mounting process, the moisture-absorbed electronic component device is exposed to high temperature during the soldering process, and due to the explosive stress of rapidly vaporized water vapor, cracks or internal peeling occur, reducing...

AI Technical Summary

Problems solved by technology

As a conventional technique, a method of improving high-temperature storage characteristics and soldering resistance by combining an epoxy resin having a naphthalene skeleton and a phenolic resin-based curing agent having a naphthalene skeleton has been proposed (see, for example, Patent Document 3). Phosphorus compounds are used to improve high-temperature storage characteristics and flame resistance (for example, refer to Patent Documents 4 and 5), but it is difficult to say that the balance of flame resistance, continuous formability, and welding resistance in these methods is sufficient

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