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Plasma film-forming device

A film-forming device and plasma technology, applied in metal material coating process, melt spraying, coating and other directions, can solve the problems of difficult plasma jet area, reduce production efficiency, reduce product quality, etc., and achieve high deposition efficiency, gaseous The effect of stable flow and less sparking phenomenon

Inactive Publication Date: 2013-07-03
FUYU PRECISION COMPONENTKUNSHANCO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method of controlling the shape of the plasma jet area by adjusting the coil current is easily affected by factors such as vacuum degree and gas flow rate, so it is difficult to stably control the shape of the plasma jet area, thereby reducing product quality, increasing defective rate and reducing production. efficiency

Method used

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Embodiment Construction

[0015] The plasma film forming device provided in the embodiments of the present invention will be further described in detail below with reference to specific embodiments and drawings.

[0016] Please refer to figure 1 and figure 2 , The plasma film forming apparatus 100 of the embodiment of the present invention includes a film forming chamber 10 , a plasma generator 20 , a rotating support frame 30 , a plurality of gas carrier plates 40 and a film material supply module 50 .

[0017] The bottom wall of the film forming chamber 10 is provided with a plasma generator 20 , and the opposite top wall is provided with a rotating support frame 30 . The film forming chamber 10 also includes a gas inlet 11 opened on the bottom wall thereof, and the gas inlet 11 can be connected to an external gas supply system (not shown in the figure) to provide the film forming chamber 10 with protective gas. A vacuum port 12 connected to an external vacuum device (not shown) is provided on the...

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Abstract

The invention discloses a plasma film-forming device. The plasma film-forming device comprises a film-forming chamber, a plasma generator arranged in the film-forming chamber, and a gas supply system used for providing a gas for the film-forming chamber, wherein the plasma generator sprays a plasma jet flow and forms a plasma jet flow area. The plasma film-forming device further comprises a plurality of gas flow-carrying plates rotationally arranged around the plasma generator, wherein the gas supply system supplies the gas for the gas flow-carrying plates, and the gas is jetted to the plasma jet flow area via the gas flow-carrying plates; and the shape of the plasma jet flow area can be changed by rotating the gas flow-carrying plates. The film plated by the plasma film-forming device is high in deposition efficiency and few in spark phenomenon while being high in compactness and good in uniformity.

Description

technical field [0001] The invention relates to a film forming device, in particular to a plasma film forming device. Background technique [0002] At present, due to the ultra-high temperature characteristics of the plasma spraying technology used in the plasma film forming device, it is convenient to spray high melting point materials; and the plasma film forming device has the characteristics of high spraying particle speed, dense coating, and high bonding strength. Plasma spraying technology is widely used in the film-forming process of products such as [0003] During the film forming process, the shape of the plasma jet area emitted by the plasma film forming device needs to be controlled according to the requirements of the film to be formed (such as the density and thickness of the film, etc.). In the existing plasma film forming device, the shape of the plasma jet area is controlled by adjusting the coil current in the plasma film forming device. For example, when...

Claims

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Application Information

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IPC IPC(8): C23C4/12C23C4/134
Inventor 裴绍凯
Owner FUYU PRECISION COMPONENTKUNSHANCO LTD
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