Assessment method of storage lives of lead bonding air-impermeability encapsulation analogue integrated circuits

Abstract

The invention provides an assessment method of storage lives of lead bonding air-impermeability encapsulation analogue integrated circuits. The method comprises the following steps: selecting and screening qualified samples, and separating the samples into a plurality of groups at random; measuring and calculating relative humidity inside one group of samples and an average value of bonding strength of bonding wires; conducting accelerated life tests by using steady temperature accelerated stress, temperature cycling accelerated stress and steady damp and heat accelerated stress, and enabling the samples under steady damp heat tests to be uncovered first; detecting sensitivity parameters of the samples at certain intervals; confirming the sensitivity parameters and life distribution types of the samples, and conducting matching to obtain distribution parameters; calculating average lives of the samples; calculating model parameters and accelerated factors of accelerated models according to the average lives of the samples under different stress conditions; and deducing the lives of the samples under actual storage conditions. According to the method, test stress is selected reasonably, monitored parameters are comprehensive, and the sensitivity parameters can be accurately distinguished. The method is mainly applied to the field of reliability assessment of semiconductor analogue integrated circuits.

Description

technical field [0001] The invention relates to a method for evaluating the storage life of an integrated circuit, in particular to a method for rapidly evaluating the storage life of an analog integrated circuit in a wire-bonded airtight package by using an accelerated life test, which is mainly used in the field of reliability evaluation of a semiconductor analog integrated circuit . Background technique [0002] Hermetic packaging analog integrated circuits are widely used in aviation, aerospace and other fields that require high reliability of electronic components. The life of hermetic packaging analog integrated circuits largely determines the superior electronic system it is used in. lifespan. However, in practical applications, the hermetically packaged analog integrated circuit is in a non-working storage state during most of the task cycle. Therefore, it is necessary to evaluate the storage life of hermetically packaged analog integrated circuits. [0003] The t...

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Problems solved by technology

[0005] In order to overcome the problems of unreasonable test stress selection, incomplete monitoring parameters, and inaccurate sensitive parameter discrimination methods existing in traditional accelerated life tests when evaluating the storage life of hermetically packaged analog integrated circuits, the present invention proposes a wire bonding method. Method for storage life of hermetically packaged analog integrated circuits, which can more accurately and comprehensively evaluate the storage life of wire-bonded hermetically packaged analog integrated circuits in a shorter period of time

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