A Packaging Structure for Improving Brightness of Vertical Light-Emitting Diode Chips

Abstract

The invention provides a packaging structure for vertical light-emitting diode chip brightness, which at least includes a support system, a plastic cup connected to the periphery of the support system, an LED chip containing a light-absorbing substrate placed on the support system, and packaging glue distributed on the silicon substrate The periphery of the LED chip is characterized in that a bubble structure is formed at the interface between the side of the light-absorbing substrate and the encapsulation glue. Utilize the difference in refractive index of packaging glue, air bubbles, and silicon substrate materials to form a reflective layer, thereby effectively reducing or avoiding the light that would have been absorbed by the substrate, and reflecting it out of the packaging structure, enhancing the probability of light output, and then improving the vertical light emission level. The light intensity of the tube chip.

Description

technical field [0001] The invention relates to a packaging structure for improving the brightness of a vertical light-emitting diode chip, which avoids light loss caused by contact with a light-absorbing substrate through the design of a bracket, and improves the packaging brightness of a vertical chip, belonging to the field of light-emitting diodes. Background technique [0002] Light-emitting diode chips can be roughly divided into three categories according to their structure, namely front-mounted light-emitting diode chips, flip-chip light-emitting diode chips, and vertical light-emitting diode chips. At present, front-mounted LED chips are the most widely used on the application side. Its advantage is that the production cost is low and the yield rate is high. Therefore, the use of front-mounted LED chips is more popular at present. Generally, the lamp beads of high-power light-emitting diodes cannot meet the requirements of high-power front-mounted chips, so the deve...

AI Technical Summary

Problems solved by technology

At present, front-mounted LED chips are the most widely used on the application side. Its advantage is that the production cost is low and the yield rate is high. Therefore, the use of front-mounted LED chips is more popular at present. Generally, it is a high-power light-emitting diode lamp bead, and the high-power front-mounted chip required by it can no longer be met. The development of vertical light-emitting diode chips has emerged as the times require. The vertical electrode design makes the vertical light-emitting diode chips can withstand large power usage, and can generally be used The power of LED chip is about 1.5 times that of the formal LED chip. However, due to the design of the vertical electrode, the vertical LED chip must also use a conductive substrate. Considering the cost performance, the silicon substrate becomes an ideal choice.

[0003] Traditional silicon substrate LED vertical chip packaging structure, such as figure 1 As shown, the blue light provided by the light-emitting diode chip and the blue light enters the phosphor to excite yellow light, and the blue light and the yellow light are mixed to generate white light. During the process of blue light entering the phosphor particle, the phosphor particle will only absorb part of the blue light. , and the remaining blue light will be refracted into the next phosphor particle, so in the process of a series of light mixing, the blue light will be continuously refracted to change the light path, and even some blue light will be reflected back to the chip, because the silicon substrate will All light in the range of visible light is absorbed, especially blue light and yellow light in the visible range have a certain absorption rate, so when vertical light-emitting diodes are sealed in lighting systems, such as LED lamp beads, it will cause blue light conversion The efficiency of white light becomes worse, and its brightness will decrease

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