Thin plate-shaped workpiece adhesion and retention method, thin plate-shaped workpiece adhesion and retention device, and manufacturing system

Abstract

The present invention adheres and retains a thin plate-shaped workpiece and corrects any bending under the weight of the workpiece itself, without damaging the workpiece. In a thin plate-shaped workpiece (W) of which part is supported by a lattice-shaped support member (1), an adhesion means (2) is moved so as to approach, in a direction which intersects with the thin plate-shaped workpiece (W), a non-supported portion (W1) which has bent and deformed downward due to the weight of the workpiece itself, and part of an adhesion surface (2a) of the adhesion means (2) is brought into contact with the non-supported portion (W1). Then, the adhesion surface (2a) is moved so as to gradually increase the contact area between the adhesion surface (2a) and the non-supported portion (W1). Thus, the adhesion surface (2a) is gradually brought into contact, over a staggered time period and in a partial manner in keeping with the bending of the non-supported portion (W1) under the weight of the workpiece itself, and as this happens the external load on the thin plate-shaped workpiece is suppressed to an extremely low level, and approximately the entirety of the adhesion surface (2a) is brought into contact with, adhered to and retained against the non-supported portion (W1). Then, the adhesion means (2) is moved in the opposite direction to the abovementioned approaching direction, up until a position in which the adhesion surface (2a) is in the same plane as a supported portion (W2) in the thin plate-shaped workpiece, which is supported by a support member (1). Thus, bending, under the weight of the workpiece itself, in the non-supported portion (W1) is reduced, and the entire thin plate-shaped workpiece is adhered and retained in a planar shape.

Description

technical field [0001] The present invention relates to an adhesive for a thin-plate-shaped workpiece such as a glass substrate used in the manufacturing process of a flat-panel display (FPD) such as an organic EL display (OLED) or a liquid crystal display (LCD). A method for attaching and holding a thin plate-shaped work, an apparatus for adhering and holding a thin plate-shaped workpiece used for carrying out the method, and a manufacturing system provided with the apparatus for adhering and holding a thin-plate-shaped workpiece and used for manufacturing, for example, an organic EL display (OLED). Background technique [0002] Conventionally, as an organic EL device, a film formation mask having an opening corresponding to a film formation area and a film formation substrate are superimposed and a functional film constituting an organic EL element is deposited on the film formation area of ​​the film formation substrate. The device manufacturing device has the following d...

AI Technical Summary

Problems solved by technology

[0010] However, as described in Patent Document 1, in an apparatus that pinches the substrate between the magnet and the film-forming mask by the magnetic attraction force of the magnet, as the size of the substrate increases, one side of the film-forming mask becomes If the thickness becomes larger than 2000mm, even if the magnet, the large substrate, and the peripheral part of the film-forming mask are held by the holder-shaped holding part, the central part (non-supporting part) of these laminates will bend due to its own weight. If it sags below the magnetic attraction area of ​​the magnet, the non-supporting part cannot be returned to a flat shape by magnetically attracting the magnet

[0011] Therefore, there is a problem that the mask pattern in the film-forming mask is deformed or warped, and an accurate pattern cannot be formed, resulting in a decrease in productivity.

[0012] In addition, as in the above-mentioned Patent Document 2, in the method and apparatus in which the substrate is pinched between the substrate supporting surface of the magnet unit and the vapor deposition mask by the magnetic attraction force of the magnet, and then these are turned upside down as a whole, as the size of the substrate changes, As the size increases, one side of the deposition mask or the magnet unit becomes larger to 2000 mm or more and becomes heavy. Therefore, it is difficult to easily reverse up and down even with a transport mechanism such as a robot, and there are problems such as lack of realizability.

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