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Photosensitive resin composition and photocuring pattern manufactured thereby

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problems such as the realization of fine pattern and elastic recovery rate that have not been satisfied, and achieve the effect of excellent elastic recovery rate and excellent realization.

Active Publication Date: 2017-12-01
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] As an example, Korean Laid-Open Patent No. 2009-0056862 discloses a photosensitive resin composition comprising a binder as a copolymer of unsaturated carboxylic acid and / or unsaturated carboxylic acid anhydride and aliphatic polycyclic epoxy compound. agent resin, but the reality is that the realization of fine patterns and the elastic recovery rate are still not satisfied

Method used

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  • Photosensitive resin composition and photocuring pattern manufactured thereby
  • Photosensitive resin composition and photocuring pattern manufactured thereby
  • Photosensitive resin composition and photocuring pattern manufactured thereby

Examples

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manufacture example

[0137] In manufacture examples 1 and 2, the measurement of a weight average molecular weight (Mw) and a number average molecular weight (Mn) was performed on the following conditions using the GPC method. In addition, let ratio of weight average molecular weight and number average molecular weight be molecular weight distribution (Mw / Mn).

[0138] Device: HLC-8120GPC (manufactured by Tosoh Corporation)

[0139] Column: TSK-GELG4000HXL+TSK-GELG2000HXL (connected in series)

[0140] Column temperature: 40°C

[0141] Mobile phase solvent: tetrahydrofuran

[0142] Flow rate: 1.0ml / min

[0143] Injection volume: 50μl

[0144] Detector: RI

[0145] Measurement sample concentration: 0.6% by weight (solvent = tetrahydrofuran)

[0146] Standard material for calibration: TSK STANDARD POLYSTYRENE F-40, F-4, F-1, A-2500, A-500 (manufactured by Tosoh Corporation)

manufacture example 1A-1

[0147] [Manufacture example 1] Manufacture of A-1 (first resin)

[0148] 182 g of propylene glycol monomethyl ether acetate was charged into a flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel, and a nitrogen introduction tube, and after changing the atmosphere in the flask from air to nitrogen, the temperature was raised to 100°C. Then, in a mixture containing 35.4 g (0.30 moles) of vinyl toluene, 36.0 g (0.50 moles) of acrylic acid, 59.6 g (0.2 moles) of 2-hydroxyl-o-phenylphenol propyl acrylate and propylene glycol monomethyl ether acetic acid A solution of 3.6 g of azobisisobutyronitrile was added to a mixture of 136 g of the ester, and it was dropped into the flask from the dropping funnel over 2 hours, and stirring was continued at 100° C. for 5 hours. Next, the atmosphere in the flask was changed from nitrogen to air, and 22.5 g [0.15 mol, (50 mol % with respect to the acrylic acid used in this reaction)] of glycidyl methacrylate, tris(...

manufacture example 2

[0149] [Manufacture example 2] Manufacture of A-2 (second resin)

[0150] In a 1L flask equipped with a reflux condenser, dropping funnel, and stirrer, nitrogen was flowed in at 0.02L / min to form a nitrogen atmosphere, 150g of diethylene glycol ethyl methyl ether was put in, and heated to 70°C while stirring . Next, 198.2 g (0.90 mol) of the mixture of the above chemical formula 6 and chemical formula 20 (the molar ratio is 50:50) and 8.6 g (0.10 mol) of methacrylic acid were dissolved in 150 g of diethylene glycol ethyl methyl ether to prepare solution.

[0151]

[0152] After dropping the prepared solution into the flask using a dropping funnel, 27.9 g of the polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) was added to the flask over a period of 4 hours using another dropping funnel. (0.11mol) solution dissolved in 200 g of diethylene glycol ethyl methyl ether was dropped into the flask. After the dropwise addition of the solution of the polymerization ...

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Abstract

The invention provides a photosensitive resin composition capable of having an excellent elastic recovery ratio after curing, forming a photocuring pattern having a hard characteristic which reduces the deformation caused by the external pressure, realizing excellent realizing property of micro-fine patterns, and adjusting the size of the patern through adjustment of the amount of a photopolymerizaton initiating agent. The invention relates to a photosensitive resin composition, and more specifically relates to a photosensitive resin compoisiton including an alkaline soluble resin (A), a photopolymerization initiating agent (B), a photopolymerizable compound (C), and a solvent (D), the alkaline soluble resin (A) contains a first resin and a second resin, and the photopolymerization initiating agent (B) contains a compound with a specific structure.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a photocurable pattern manufactured with the composition and an image display device with the photocurable pattern. Background technique [0002] In general display devices, in order to maintain a constant distance between upper and lower substrates, silica beads or plastic beads having a constant diameter are used. However, when these beads are randomly dispersed on the substrate and located inside the pixel, there is a problem that the aperture ratio decreases and light leakage occurs. In order to solve this problem, spacers formed by photolithography inside display devices have been used, and almost all spacers used in display devices are now formed by photolithography. [0003] The spacer formation method using photolithography is to apply a photosensitive resin composition on a substrate, and after being irradiated with ultraviolet rays through a mask, it is formed at a desired ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004G02F1/1339
CPCG02F1/13392G03F7/004G03F7/027G03F7/028G03F7/0048C08G14/04C08K5/32C08G59/1455G03F7/2055G02F1/1335G02F1/1339
Inventor 崔硕均崔和燮朴汉雨
Owner DONGWOO FINE CHEM CO LTD