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Laser wet cutting processing method

A technology of cutting processing and laser cutting machine, which is applied in the direction of laser welding equipment, metal processing equipment, manufacturing tools, etc., which can solve the problems of difficult removal of debris and thermal damage of parts, so as to improve processing quality, prevent excessive burning, reduce pollution effect

Active Publication Date: 2015-11-25
KUNSHAN THETA MICRO
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0010] The technical problem to be solved by the present invention is that in the process of laser processing micro-diameter pipes, the heat generated will cause thermal damage to the parts, and the debris is not easy to remove. It provides a laser wet cutting processing method, which has the advantages of damage to the parts. The advantages of small heat damage and easy removal of debris generated during cutting

Method used

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Examples

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Embodiment 1

[0042] This example provides a laser wet cutting processing method, which includes the following steps: fixing the pipe to be cut on the rotating shaft of the laser cutting machine with a pre-spray structure and a coaxial nozzle; The water guide pipe of the system is inserted from one end of the thin-walled pipe to be cut; start the rotating shaft of the laser cutting machine to rotate the pipe to be cut; start the water guide system of the laser cutting machine to rotate the water guide pipe; start the water circulation module of the laser cutting machine ;Start the cutting head of the laser cutting machine to cut the pipe;

[0043] Wherein, the laser cutting machine containing pre-spray structure and coaxial nozzle, such as figure 1 As shown, it includes a coaxial water jet device 9, a fixture 10, a sealing plug 11 and a pre-spray water-guiding mechanism, the pre-spray water-guiding mechanism contains an automatic water supply system; the pre-spray water-guiding mechanism, ...

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Abstract

The invention relates to a laser wet cutting machining method which mainly solves the problems in the prior art that when a laser cutting machine processes a pipe with a small diameter, the produced heat damages parts and chips are not easily removed. The laser wet cutting method comprises the following steps that the pipe to be cut is fixedly arranged on the rotary shaft of the cutting machine, a water guiding pipe of the water guiding system of the cutting machine is inserted from one end of the thin-wall pipe to be cut, the laser cutting machine is started so that the pipe to be cut rotates, the water guiding system of the laser cutting machine is started so that the water guiding pipe rotates, the water circulation module of the laser cutting machine is started, and the cutting head of the laser cutting machine is started to cut the pipe. Due to the adoption of the technical scheme, the problems are well solved, and the laser cutting machining method can be used in the industrial production of laser wet cutting machining.

Description

technical field [0001] The invention relates to a laser wet cutting processing method for thin-walled pipes, in particular to a laser wet cutting processing method with a pre-spray water guiding system. Background technique [0002] Laser cutting technology is widely used in the processing of metal and non-metal materials due to its advantages of reducing processing time, reducing processing costs and improving workpiece quality, and laser cutting processing is gradually replacing traditional cutting tools. [0003] Laser micromachining has become the main method for thin-walled pipe processing due to its high processing efficiency, less cutting residue, non-contact processing, and easy automation of the processing process. The laser cutting of thin-walled pipe is to move the overlapping laser pulse points along the cutting line on the pipe, and at the same time input high pressure oxygen to assist melting and cutting. The material at the laser focus point is melted and gas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/70B23K26/146B23K26/14
Inventor 魏志凌宁军夏发平马秀云
Owner KUNSHAN THETA MICRO
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