Preparation method of para-aramid paper-based composite material for printed circuit board

A technology of printed circuit substrate and para-aramid paper, applied in the field of papermaking, can solve the problems of cracking, easy warping of the printed circuit substrate, etc., and achieve the effects of simple process, excellent heat resistance and low density

Inactive Publication Date: 2016-04-20
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for preparing a para-aramid paper-based composite material for printed circuit boards, which solves the problem that the existing printed circuit boards are easy to warp and crack

Method used

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Examples

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Effect test

preparation example Construction

[0022] The method for preparing a para-aramid paper-based composite material for printed circuit substrates of the present invention includes the following specific steps:

[0023] Step 1, soak the para-aramid chopped fiber in a concentration of 1.2×10 -3 Stir and wash in the mol / L sodium dodecylbenzenesulfonate solution until the impurities on the surface of the para-aramid chopped fiber are removed, and then wash the sodium dodecylbenzenesulfonate solution in the para-aramid chopped fiber , And then decompose in a standard fiber decomposer, the decomposing concentration is 0.8-1.6%, to obtain the para-aramid chopped fiber slurry;

[0024] Step 2: Dissolve the polyester fiber in a standard fiber disintegrator, with a disintegration concentration of 0.4-0.8%, to obtain a polyester fiber slurry;

[0025] Step 3, sieving the para-precipitated fibers with a Bauer-Mcnett sieve, and then taking the 100-mesh fiber component to disintegrate in a standard fiber disintegrator, and the disinte...

Embodiment 1

[0032] Step 1, soak the para-aramid chopped fiber in a concentration of 1.2×10 -3 Stir and wash in the mol / L sodium dodecylbenzenesulfonate solution until the impurities on the surface of the para-aramid chopped fiber are removed, and then wash the sodium dodecylbenzenesulfonate solution in the para-aramid chopped fiber , And then dissolve in a standard fiber disintegrator, the disintegration concentration is 0.8%, to obtain para-aramid chopped fiber slurry;

[0033] Step 2: Dissolve the polyester fiber in a standard fiber disintegrator, with a disintegration concentration of 0.4%, to obtain a polyester fiber slurry;

[0034] Step 3, sieving the para-precipitated fibers with a Bauer-Mcnett sieve, and then taking the 100-mesh fiber component to be decomposed in a standard fiber decomposing machine, with a decomposing density of 1.5%, to obtain the para-precipitating fiber slurry;

[0035] Step 4. Mix the para-aramid chopped fiber slurry obtained in step 1, the polyester fiber slurry o...

Embodiment 2

[0039] Step 1, soak the para-aramid chopped fiber in a concentration of 1.2×10 -3 Stir and wash in the mol / L sodium dodecylbenzenesulfonate solution until the impurities on the surface of the para-aramid chopped fiber are removed, and then wash the sodium dodecylbenzenesulfonate solution in the para-aramid chopped fiber , And then dissolve in a standard fiber disintegrator, the disintegration concentration is 1.0%, to obtain the para-aramid chopped fiber slurry;

[0040] Step 2: Dissolve the polyester fiber in a standard fiber disintegrator, with a disintegration concentration of 0.6%, to obtain a polyester fiber slurry;

[0041] Step 3, sieving the para-fibre with a Bauer-Mcnett sieve, and then taking the 100-mesh fiber component to decompose in a standard fiber decomposing machine, with a decomposing density of 2.0%, to obtain the para-fibre slurry;

[0042] Step 4. Mix the para-aramid chopped fiber slurry obtained in step 1, the polyester fiber slurry obtained in step 2 and the pa...

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Abstract

The invention discloses a preparation method of a para-aramid paper-base composite material for a printed circuit board. The method specifically comprises the following steps of: (1) uniformly mixing the para-aramid chopped fiber pulp, polyester fiber pulp and para-precipitation fiber pulp and then defibering; and adding a polyethylene oxide dispersing agent and adding water to adjust the paper pulp concentration to obtain a pulp suspension; (2) performing manufacturing molding and hot pressing on the pulp suspension obtained by the step (1) to obtain para-aramid paper-base raw paper; and (3) steeping the para-aramid paper-base raw paper obtained by the step (2) in a polyimide resin glue solution, and drying to obtain a para-aramid paper-base composite material for a printed circuit board. According to the invention, the prepared para-aramid paper-base composite material for the printed circuit board has low dielectric constant, small coefficient of linear expansion, good heat resistance, wide using temperature range, good mechanical property, low density and corrosion resistance, and can adapt to the development trend of the printed circuit boards.

Description

Technical field [0001] The invention belongs to the technical field of papermaking and relates to a preparation method of a para-aramid paper-based composite material for a printed circuit substrate. Background technique [0002] With the rapid development of the information industry, electronic products are showing the development trend of light and thin, multi-functional and high-frequency, which requires the performance of printed circuit substrate materials to be high in heat resistance, low thermal expansion coefficient, low dielectric constant and Development of high signal transmission speed. At present, the commonly used printed circuit substrates are metal base, glass fiber cloth base and ceramic base materials. [0003] The heat dissipation performance of metal materials is relatively poor. In addition, in order to ensure the insulation between the substrate and the copper layer, an insulating layer must be provided between the copper layers, which not only increases the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): D21H13/26D21H21/08D21H17/56D21H17/35
Inventor 张美云刘俊华陆赵情田志军
Owner SHAANXI UNIV OF SCI & TECH
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