Mounting structure for circuit component and method for mounting circuit component

Abstract

In the present invention, comparatively large circuit components such as electrolytic capacitors and film capacitors are mounted on a circuit board with the height of the circuit components that protrude above the circuit board controlled while preventing noise from arising because of contact with the circuit board. To do so, the circuit board has hole parts or cutouts disposed in the main body parts for circuit components mounted on the circuit board and protruding parts having a shape that protrudes from one side or a plurality of sides of the hole parts or cutouts. Furthermore, the circuit components are disposed on the circuit board in a state where the main body parts of the circuit components pass through the hole parts or cutout parts and a state in which the main body parts of the circuit components do not come into contact with the circuit board except at the protruding parts. Furthermore, to maintain these states, the protruding parts and the main body parts of the circuit components are attached by fixing members provided on the protruding parts and the circuit components affixed to the circuit board.

Description

technical field [0001] The present invention relates to a circuit member mounting structure and a circuit member mounting method for mounting on a circuit board used in electrical equipment such as a plasma display device, for example. Background technique [0002] In a representative AC surface discharge panel as a plasma display panel (hereinafter abbreviated as "panel"), a plurality of discharge cells are formed between a front substrate and a rear substrate that are arranged to face each other. In the front substrate, a plurality of display electrode pairs are formed parallel to each other on the glass substrate on the front side, and the display electrode pairs are composed of a pair of scan electrodes and sustain electrodes. Furthermore, a dielectric layer and a protective layer are formed so as to cover these display electrode pairs. [0003] In the rear substrate, a plurality of parallel data electrodes are formed on a glass substrate on the rear side, a dielectric ...

AI Technical Summary

Problems solved by technology

[0010] Furthermore, in a plasma display device with a larger screen size, due to the increase in the size of the plasma display device itself or the increase in the size of the circuit board, it becomes more likely to be affected by vibrations generated outside the plasma display device. As a result, a new problem arises: The circuit components of the substrate are prone to vibration

[0011] In particular, in a plasma display device with a built-in speaker, vibration tends to occur in circuit members as the size increases.

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