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Bonding apparatus and bonding method

A technology of sticking device and sticking board, applied in the direction of lamination device, chemical instrument and method, control lamination, etc., can solve the problem of large warpage of the laminated board, and achieve the effect of reducing defects

Active Publication Date: 2013-07-31
ASAHI GLASS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The warpage of the laminate is large because the sheet tends to return to its original shape after pasting

Method used

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  • Bonding apparatus and bonding method
  • Bonding apparatus and bonding method

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Embodiment Construction

[0034] Hereinafter, modes for implementing the present invention will be described with reference to the drawings. In each drawing, the same or corresponding reference numerals are attached to the same or corresponding components, and descriptions thereof are omitted.

[0035] The bonding apparatus of this embodiment bonds a substrate and a reinforcing plate in response to thinning of a substrate used in an electronic device. After the functional layer is formed on the substrate reinforced with the reinforcing plate, the substrate and the reinforcing plate are peeled off to manufacture an electronic device having the substrate and the functional layer. The stiffener does not become part of the electronics.

[0036] Here, the electronic device refers to electronic components such as a display panel, a solar cell, and a thin-film secondary battery. The display panel includes a liquid crystal panel (LCD), a plasma panel (PDP), and an organic EL panel (OLED).

[0037] (Laminate...

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Abstract

The invention provides a bonding apparatuse for reducing defect and warping of laminating plate after bonding and a bonding method. The bonding device (10) is used for bonding a plate shaped component (2) and a flexible plate (3), wherein, the device comprises: an upper working table (20) for absorbing a plate shaped component; a lower working table quippped below the upper working table (20) for carrying the flexbile plate (3); a rotating roller (50) which contacts the lower surface of the flexible plate (3) supported by the lower working table (40) and flexibly deforms the flexible plate (3) by dead weight; a pressing part (50) for pressing the flexible plate (3) to the plate shaped component (2) absorbed by the upper working table (20) by the rotating roller (50); a moving mechanism (70) for moving the rotating roller (50) and the pressing part (60) relative to the upper working table (20).

Description

technical field [0001] The invention relates to a pasting device and a pasting method. Background technique [0002] As electronic devices such as display panels, solar cells, and thin-film secondary batteries become thinner and lighter, substrates used in electronic devices are required to be thinner. If the substrate becomes thinner, the handleability of the substrate deteriorates, so it is difficult to form functional layers for electronic devices (such as thin film transistors and color filters) on the substrate. [0003] Therefore, a method has been proposed in which a substrate and a reinforcing plate are bonded together to manufacture a laminate, and a functional layer is formed on the substrate of the laminate, and then the substrate and the reinforcing plate are peeled off (see, for example, Patent Document 1). In Patent Document 1, a vacuum press machine is used for bonding between the substrate and the reinforcing plate. [0004] Also, as a method of bonding a s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/00
CPCB32B17/00B32B37/10B32B41/00C03C27/06
Inventor 宇津木洋伊藤泰则内田大辅立山优贵
Owner ASAHI GLASS CO LTD
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