Filled polymer based heat conductive plastic and preparation method thereof

Abstract

The invention discloses a filled polymer based heat conductive plastic and a preparation method thereof. The heat conductive plastic comprises the following raw materials, by mass, 60-80% of a matrix resin, 3-40% of a heat conductive filler, 5-10% of a toughener, 1-2% of a coupling agent, 0.1-0.5% of an antioxidant and 0.2-1.5% of a lubricant. The heat conductive plastic is prepared through a melt blending extrusion process. The heat conductive plastic has the advantages of high heat conduction coefficient, convenient processing molding, and high design freedom degree.

Description

technical field [0001] The invention belongs to the technical field of chemical materials, and in particular relates to a filled polymer-based heat-conducting plastic and a preparation method thereof. Background technique [0002] Metal is widely used for heat dissipation due to its excellent thermal conductivity, but there are also many problems with metal heat-conducting materials, such as heavy weight and poor corrosion resistance. Thermally conductive plastics can overcome the disadvantages of metals, and are easy to process and shape, while having lower costs and a high degree of freedom in product design. [0003] In order to obtain plastics with high thermal conductivity, the existing patented technologies focus on the selection of fillers and surface modification. The usual method is to add fillers with high thermal conductivity, such as adding high-density metals and metal oxides as thermal conductive fillers (ZL99815810.0) to carbon fibers with high aspect ratios ...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to propose a thermally conductive plastic and its preparation method, which overcomes the problems of low thermal conductivity, difficult processing and molding, and high cost of existing thermally conductive materials. It has high thermal conductivity, convenient processing and molding, and high degree of freedom in product design.

Images