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Method for baseplate drying under reduced pressure and device thereof

A drying method and technology for substrates, which are used in drying solid materials, local stirring dryers, and static materials dryers, etc., can solve problems such as decompression drying spots, and achieve the effect of easy process control, saving control process, and reducing difficulty.

Inactive Publication Date: 2013-08-07
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: how to provide a substrate decompression drying method and device to solve the problem of decompression drying spots existing in the decompression drying process of the existing substrate

Method used

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  • Method for baseplate drying under reduced pressure and device thereof
  • Method for baseplate drying under reduced pressure and device thereof

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Embodiment Construction

[0049] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0050] In order to solve the problem of drying spots existing in the existing substrate decompression drying process, the present invention provides a substrate decompression drying method and device.

[0051] The flow chart of the inventive method is as figure 1 As shown, with reference to the diagram, the method specifically includes the following steps:

[0052] S1: placing the substrate in a sealed space;

[0053] S2: dividing the surface to be dried of the substrate into sequentially adjacent set sealing areas;

[0054] Adjacent successively means that according to the actual shape of the substrate, the substrate is divided into simple geometric sealing areas from ...

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Abstract

The invention discloses a method for baseplate drying under reduced pressure and a device thereof, and belongs to the technical field of baseplate manufacture. The method comprises the following steps: firstly, placing a baseplate in a sealed space; secondly, dividing the surface to be dried of the baseplate into a preset number of sealing zones; thirdly, performing air extraction and pressure reduction for the sealing zones; and fourthly, performing air blowing and drying for the sealing zones, and taking the baseplate out of the sealed space. The method disclosed by the invention can perform drying under reduced pressure for baseplates of all sizes, can guarantee the uniformity of pressure and moisture as much as possible, and prevent the formation of spots caused by drying under reduced pressure.

Description

technical field [0001] The invention relates to the technical field of substrate manufacturing, in particular to a substrate decompression drying method and device. Background technique [0002] There are two ways to set the exhaust hole of the current vacuum drying (VCD) equipment, one is central exhaust, and the other is peripheral exhaust. However, no matter which exhaust method is used, for a large-sized glass substrate, due to the small number of exhaust holes and the distribution problem, the exhaust will be uneven, and the fluidity of the photoresist itself is poor, resulting in the surface of the substrate. Uneven airflow, different humidity on the surface of the substrate, etc., after decompression drying, will produce decompression drying spots, the most common of which are crescent-like spots. At present, the industry cannot effectively control the spots of decompression drying, which increases the misjudgment rate of the substrate quality, is not conducive to th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F26B5/04H01L21/67F26B9/06
CPCF26B5/045F26B5/04H01L21/02052H01L21/67034
Inventor 王耸王冀豫冯贺吴洪江
Owner BOE TECH GRP CO LTD
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