RPMC-comprising (replay protection monotonic counter-comprising) enhanced flash chip and packaging method thereof
An enhanced chip technology, applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of high design complexity, large chip area, high design cost, etc., to reduce development costs, reduce area, The effect of improving performance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0067] Embodiment 1 of the present invention proposes an enhanced Flash chip containing RPMC. The chip may include: Flash and RPMC packaged together, and memory connected to the RPMC.
[0068] In a preferred embodiment of the present invention, the memory can be an independent chip; in another preferred embodiment of the present invention, the memory can also be in the form of flip-flops or internal RAM (random access memory) Set in RPMC.
[0069] As an example of a specific application of the embodiment of the present invention, the memory may be an SRAM (Static Random Access Memory), and may also be a DRAM (Dynamic Random Access Memory), which is not limited in the present invention.
[0070] In the embodiment of the present invention, Flash and RPMC may be independent chips. Flash can choose different capacities to meet the needs of different systems. This Flash can reuse the designed Flash chip, so it does not need to be redesigned, which greatly reduces the development c...
Embodiment 2
[0082] In the following, the enhanced Flash chip containing RPMC will be introduced in detail through Embodiment 2 of the present invention.
[0083] refer tofigure 1 , which shows a schematic diagram of logical connections of an enhanced Flash chip containing RPMC described in Embodiment 2 of the present invention.
[0084] From figure 1 It can be seen that the enhanced Flash chip containing RPMC described in the embodiment of the present invention may include Flash and RPMC packaged together, and a memory connected to the RPMC.
[0085] Among them, both Flash and RPMC include multiple pins, and the same IO pins in RPMC and Flash can be connected to the same set of external shared pins, and the commands sent from the outside will be received by RPMC and Flash at the same time, RPMC and Flash can respond accordingly; Flash and RPMC also include internal IO pins, and the internal IO pins of Flash are interconnected with the internal IO pins of RPMC; RPMC and Flash also have th...
Embodiment 3
[0171] Next, the specific packaging method of the above chip will be introduced through the third embodiment of the present invention.
[0172] refer to Figure 4 , shows a flow chart of the steps of Embodiment 1 of a method for encapsulating an enhanced Flash chip containing RPMC described in Embodiment 3 of the present invention, and may specifically include the following steps:
[0173] Step 400, the Flash to be packaged and the response protection monotonic counter RPMC, and the memory chip memory connected to the RPMC are placed on the chip carrier, and the Flash, the RPMC and the memory are independent of each other;
[0174] In the embodiment of the present invention, the Flash, RPMC and independent memory are mainly packaged together to obtain an enhanced Flash chip containing RPMC, and the Flash, the RPMC and the memory in the chip are independent of each other.
[0175] First, the Flash, RPMC and memory that need to be packaged can be placed on the chip carrier, and...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com