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RPMC-comprising (replay protection monotonic counter-comprising) enhanced flash chip and packaging method thereof

An enhanced chip technology, applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of high design complexity, large chip area, high design cost, etc., to reduce development costs, reduce area, The effect of improving performance

Active Publication Date: 2013-08-07
GIGADEVICE SEMICON (BEIJING) INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides an enhanced Flash chip containing RPMC and a packaging method for an enhanced Flash chip containing RPMC to solve the problems of high design complexity, long design cycle, high design cost, and excessive chip area

Method used

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  • RPMC-comprising (replay protection monotonic counter-comprising) enhanced flash chip and packaging method thereof
  • RPMC-comprising (replay protection monotonic counter-comprising) enhanced flash chip and packaging method thereof
  • RPMC-comprising (replay protection monotonic counter-comprising) enhanced flash chip and packaging method thereof

Examples

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Embodiment 1

[0067] Embodiment 1 of the present invention proposes an enhanced Flash chip containing RPMC. The chip may include: Flash and RPMC packaged together, and memory connected to the RPMC.

[0068] In a preferred embodiment of the present invention, the memory can be an independent chip; in another preferred embodiment of the present invention, the memory can also be in the form of flip-flops or internal RAM (random access memory) Set in RPMC.

[0069] As an example of a specific application of the embodiment of the present invention, the memory may be an SRAM (Static Random Access Memory), and may also be a DRAM (Dynamic Random Access Memory), which is not limited in the present invention.

[0070] In the embodiment of the present invention, Flash and RPMC may be independent chips. Flash can choose different capacities to meet the needs of different systems. This Flash can reuse the designed Flash chip, so it does not need to be redesigned, which greatly reduces the development c...

Embodiment 2

[0082] In the following, the enhanced Flash chip containing RPMC will be introduced in detail through Embodiment 2 of the present invention.

[0083] refer tofigure 1 , which shows a schematic diagram of logical connections of an enhanced Flash chip containing RPMC described in Embodiment 2 of the present invention.

[0084] From figure 1 It can be seen that the enhanced Flash chip containing RPMC described in the embodiment of the present invention may include Flash and RPMC packaged together, and a memory connected to the RPMC.

[0085] Among them, both Flash and RPMC include multiple pins, and the same IO pins in RPMC and Flash can be connected to the same set of external shared pins, and the commands sent from the outside will be received by RPMC and Flash at the same time, RPMC and Flash can respond accordingly; Flash and RPMC also include internal IO pins, and the internal IO pins of Flash are interconnected with the internal IO pins of RPMC; RPMC and Flash also have th...

Embodiment 3

[0171] Next, the specific packaging method of the above chip will be introduced through the third embodiment of the present invention.

[0172] refer to Figure 4 , shows a flow chart of the steps of Embodiment 1 of a method for encapsulating an enhanced Flash chip containing RPMC described in Embodiment 3 of the present invention, and may specifically include the following steps:

[0173] Step 400, the Flash to be packaged and the response protection monotonic counter RPMC, and the memory chip memory connected to the RPMC are placed on the chip carrier, and the Flash, the RPMC and the memory are independent of each other;

[0174] In the embodiment of the present invention, the Flash, RPMC and independent memory are mainly packaged together to obtain an enhanced Flash chip containing RPMC, and the Flash, the RPMC and the memory in the chip are independent of each other.

[0175] First, the Flash, RPMC and memory that need to be packaged can be placed on the chip carrier, and...

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Abstract

The invention provides an RPMC-comprising (replay protection monotonic counter-comprising) enhanced flash chip and a packaging method thereof. The RPMC-comprising enhanced flash chip comprises a flash, an RPMC, and a memory chip, wherein the flash and the RPMC are packaged together and the memory chip is connected with the RPMC. Both the flash and the RPMC comprise respectively independent controllers. Same IO (input and output) pins in the flash and the RPMC are interconnected and are connected to a same external shared pin of the chip. Both the flash and the RPMC further comprise internal IO pins. The RPMC and the memory chip further comprise signal transmission IO pins. By the RPMC-comprising enhanced flash chip, the problems of high complexity, long cycle, high cost and large chip area in chip design are solved.

Description

technical field [0001] The invention relates to the field of chip technology, in particular to an enhanced Flash chip containing RPMC, and a packaging method for the enhanced Flash chip containing RPMC. Background technique [0002] The enhanced FLASH with Replay Protection Monotonic Counter (RPMC) is the Basic Input-Output System (BIOS) chip that Intel will promote. It contains a high-capacity Flash chip and RPMC circuit. Among them, the capacity of the Flash chip can be 8M, 16M, 32M, 64M, 128M, 256M or higher, and is used to store the code and data of the CPU BIOS; the RPMC circuit ensures the confidentiality and integrity of the read and write data. The RPMC circuit and its integrated Flash constitute the hardware platform of the BIOS in the personal computer (Personal Computer, PC) system. [0003] At present, when designing a Flash chip containing RPMC, designers usually integrate large-capacity Flash and RPMC on one chip, that is, the RPMC circuit and Flash are desig...

Claims

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Application Information

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IPC IPC(8): H01L25/18H01L23/31H01L21/98
CPCH01L2224/05554H01L2224/48137H01L2224/48145H01L2224/48227H01L2224/49171H01L2924/00012
Inventor 胡洪舒清明张赛张建军付永庆潘荣华
Owner GIGADEVICE SEMICON (BEIJING) INC
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