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A kind of preparation method of pcb segment gold finger

A gold finger and gold finger lead technology, applied in the direction of electrical connection formation of printed components, etc., can solve the problems of gold finger lead cannot be completely removed, signal transmission variation, circuit short circuit, etc., achieve good signal conduction performance, eliminate alignment tolerance, The effect of preventing short circuit

Active Publication Date: 2016-08-10
VICTORY GIANT TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the segmented gold fingers currently produced in the industry generally have the problem of wider segments, and the segmental gap is mostly maintained at the level of 8±2mil, which is likely to cause problems such as signal transmission variation and other defects.
At the same time, the existing segmented gold finger production methods often have the problem that the gold finger leads cannot be completely removed, and the gold fingers with lead wires are likely to short-circuit the circuit during use.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0030] According to the present invention, a method for preparing a PCB segmented gold finger is provided, comprising the following steps:

[0031] The PCB is sequentially subjected to outer layer dry film, graphic plating, outer layer etching, and etching of the outer layer circuit; during the process of etching the outer layer circuit, the gold finger guide line is formed on the upper part of the end where the gold-plated finger area is connected to the PCB circuit.

[0032] Apply selective ink on the PCB except the gold-plated finger reserved area and dry it;

[0033] Gold-plated fingers, forming segmented gold fingers in the gold-plated finger area;

[0034] Remove the above selective ink;

[0035] Coat the alkaline dry film on the PCB except for the gold finger, the gold finger lead and the gold finger to prevent it from being damaged during the alkali etching process;

[0036] Alkali etching to remove gold finger guide line and gold finger segment;

[0037] Solder mas...

Embodiment 1

[0040] In this embodiment, the method for preparing PCB segmented golden fingers is as follows:

[0041] First of all, pre-processing such as cutting and drilling is completed on the copper clad laminate.

[0042] The outer layer dry film, pattern electroplating, and outer layer etching are carried out in sequence, and the outer layer circuit is etched and tested, and the outer layer circuit inspection is performed; in this process, the gold finger guide line is formed on the upper part of the gold-plated finger area.

[0043] Apply liquid selective ink on the PCB except for the gold-plated finger area, and then dry it; in this embodiment, the thickness of the selective ink coating is 1 mil, the drying temperature is 80°C, and the drying time is 20 minutes.

[0044] Gold-plated finger; according to the size and thickness of the gold finger, select the parameters of the gold-plated finger; in the present embodiment, the effective groove length of the nickel groove is 5m, and th...

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PUM

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Abstract

The invention discloses a PCB (printed circuit board) segmentation golden finger preparation method, which comprises the following working procedures of: a, etching an outer layer circuit, and forming a golden finger lead; b, coating a slipcover to form a golden finger plating area; c, plating the golden finger; d, removing the slipcover; e, coating areas except the golden finger, the golden finger lead and the golden finger segmentation with the slipcover; f, removing the golden finger lead and the golden finger segmentation; and g, preventing welding. According to the PCB segmentation golden finger preparation method disclosed by the invention, a welding-prevention working procedure is carried out after the golden finger plating, the golden finger lead removal and golden finger segmentation, so that the problems that the traditional segmentation-type golden finger production method can not effectively reduce golden finger segmentation intervals and can not thoroughly clear the golden finger lead can be thoroughly solved.

Description

technical field [0001] The invention relates to the technical field of PCB gold finger production, in particular to a method for preparing a PCB segmented gold finger. Background technique [0002] The connection between two PCBs is usually done by inserting an edge joint (commonly known as a golden finger) on one of the PCBs into a slot on the other PCB. Segmented gold fingers can form a time difference in the signal propagation process, which is especially beneficial to the transmission of high-frequency signals, realizing hot swapping of PCBs, and facilitating subsequent upgrades and maintenance of electronic products. [0003] However, currently the segmented gold fingers produced in the industry generally have the problem of wide segments, and the segment gap is mostly maintained at the level of 8±2mil, which is likely to cause problems such as signal transmission variation. At the same time, the existing segmented gold finger production methods often have the problem ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40
Inventor 张长明刘师锋黄志方
Owner VICTORY GIANT TECH HUIZHOU CO LTD