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PCB (printed circuit board) segmentation golden finger preparation method

A gold finger and gold finger lead technology, applied in the direction of electrical connection formation of printed components, etc., can solve the problems of gold finger lead cannot be completely removed, signal transmission variation, circuit short circuit, etc., achieve good signal conduction performance, eliminate alignment tolerance, The effect of preventing short circuit

Active Publication Date: 2013-08-07
VICTORY GIANT TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the segmented gold fingers currently produced in the industry generally have the problem of wider segments, and the segmental gap is mostly maintained at the level of 8±2mil, which is likely to cause problems such as signal transmission variation and other defects.
At the same time, the existing segmented gold finger production methods often have the problem that the gold finger leads cannot be completely removed, and the gold fingers with lead wires are likely to short-circuit the circuit during use.

Method used

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Examples

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Effect test

preparation example Construction

[0030] According to the present invention, a method for preparing PCB segmented gold fingers is provided, which includes the following steps:

[0031] The PCB is sequentially subjected to outer dry film, pattern plating, and outer layer etching to etch the outer layer circuit; in the process of etching the outer layer circuit, the gold finger leads are formed on the upper part of one end of the gold-plated finger area and the PCB circuit.

[0032] Coat and dry the selected ink on the PCB except the reserved area of ​​the gold-plated finger;

[0033] Gold-plated fingers, forming segmented gold fingers on the gold-plated finger area;

[0034] Remove the selected ink;

[0035] Coat the area except the gold finger, gold finger lead and gold finger on the PCB with an alkaline dry film to prevent it from being damaged in the alkaline etching process;

[0036] Alkaline etching to remove gold finger leads and gold finger segments;

[0037] Solder mask and PCB post-processing.

Embodiment 1

[0040] In this embodiment, the PCB segmented gold finger preparation method is as follows:

[0041] First, finish cutting, drilling and other pre-processing on the copper clad laminate.

[0042] The outer layer dry film, pattern plating, and outer layer etching are sequentially performed to etch the outer layer circuit and make the outer layer circuit inspection; in this process, the gold finger lead is formed on the upper part of the gold-plated finger area.

[0043] Coat the liquid selective ink on the PCB except for the gold-plated finger area and dry it; in this embodiment, the thickness of the selective ink is 1 mil, the drying temperature is 80° C., and the drying time is 20 minutes.

[0044] Gold-plated finger; according to the size and thickness of the gold finger, select the various parameters of the gold-plated finger; in this embodiment, the effective groove length of the nickel tank is 5m, and the concentration of nickel ions in the plating solution is 120g / l; the effective...

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PUM

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Abstract

The invention discloses a PCB (printed circuit board) segmentation golden finger preparation method, which comprises the following working procedures of: a, etching an outer layer circuit, and forming a golden finger lead; b, coating a slipcover to form a golden finger plating area; c, plating the golden finger; d, removing the slipcover; e, coating areas except the golden finger, the golden finger lead and the golden finger segmentation with the slipcover; f, removing the golden finger lead and the golden finger segmentation; and g, preventing welding. According to the PCB segmentation golden finger preparation method disclosed by the invention, a welding-prevention working procedure is carried out after the golden finger plating, the golden finger lead removal and golden finger segmentation, so that the problems that the traditional segmentation-type golden finger production method can not effectively reduce golden finger segmentation intervals and can not thoroughly clear the golden finger lead can be thoroughly solved.

Description

Technical field [0001] The invention relates to the technical field of PCB gold finger production, in particular to a method for preparing PCB segmented gold fingers. Background technique [0002] The connection between two PCBs is usually done by inserting the edge connector (commonly known as golden finger) on one PCB into the slot on the other PCB. The segmented golden finger can form a time difference in the signal propagation process, which is particularly conducive to the transmission of high-frequency signals and the realization of PCB hot swapping, which is convenient for the subsequent upgrade and maintenance of electronic products. [0003] However, the segmented gold fingers currently produced in the industry generally have the problem of wide segmentation, and the segmentation gap is mostly maintained at the level of 8±2mil, which is likely to cause problems such as signal transmission variation. At the same time, the existing segmented gold finger production methods o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
Inventor 张长明刘师锋黄志方
Owner VICTORY GIANT TECH HUIZHOU CO LTD