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LED module and packaging method thereof

A technology of LED modules and packaging methods, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of low light extraction efficiency and low LED light extraction efficiency, and achieve improved LED light extraction efficiency, ease of practical use and Industrialized mass production and high reliability

Inactive Publication Date: 2013-08-14
SUZHOU SUNLIGHTS TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the deficiencies of the prior art and solve the problem of low light extraction efficiency of LEDs, especially the problem of low light extraction efficiency in white LEDs (GaN-based blue LED+phosphor powder)

Method used

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  • LED module and packaging method thereof
  • LED module and packaging method thereof
  • LED module and packaging method thereof

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Experimental program
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Effect test

Embodiment 1

[0050] Such as figure 1 As shown, the packaged LED light source is sequentially composed of LED chip 1, high refractive index first coating 2, second coating 3 formed by mixing high and low refractive index materials or medium refractive index materials, and the outermost coating with low refractive index from bottom to top. Layer 4 composition. The LED light in this embodiment is emitted 1 by the LED chip, and then passes through the first coating 2 with a high refractive index, the second coating 3 with a medium refractive index, and the outermost coating 4 with a low refractive index.

Embodiment 2

[0052] Such as figure 2 As shown, the packaged LED light source is sequentially composed of LED chips 5, a first coating 6 with a high refractive index, a second coating 7 formed of materials with a high and low refractive index, and an outermost coating 8 with a low refractive index from bottom to top. Composition, each layer is mixed with appropriate proportion of phosphor powder 9 as required. The LED light in this embodiment is emitted 5 by the LED chip, and then passes through the first coating 6 with a high refractive index, the second coating 7 with a medium refractive index and the outermost coating 8 with a low refractive index upwards.

Embodiment 3

[0054] Such as image 3 As shown, the packaged LED light source is composed of an LED chip 10 , a first coating 11 with a high refractive index, and an outermost coating 12 with a low refractive index from bottom to top. The LED light in this embodiment is emitted from the LED chip 10 , passes through the first coating layer 11 with a high refractive index, and the outermost coating layer 12 with a low refractive index upwards and exits sequentially.

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Abstract

The invention provides an LED (light-emitting diode) module and a packaging method thereof. The LED module comprises an LED and coatings, wherein the coatings comprise a high-refractive-index first coating and a low-refractive-index outermost coating, wherein the high-refractive-index first coating is coated on the surface of an LED chip to increase the angle of total reflection of LED light and improve the efficiency of light shining onto the coating in the LED chip; and the low-refractive-index outermost coating is positioned on the outermost layer and used for reducing the reflection of the LED light at the air interface. Through the adoption of the invention, the light outlet efficiency of the LED chip can be improved, and meanwhile, the reflection of light in the coating is reduced, so that the LED light extraction efficiency is improved to the maximum limit, and the LED module and the packaging method have the characteristics that the structure is simple, the light outlet is uniform, the manufacturing is convenient, the reliability is high, and the practical and industrial volume production is easy.

Description

technical field [0001] The invention relates to the field of LED lamps and packaging thereof, in particular to an LED module and a packaging method thereof. Background technique [0002] With the rapid development of high-brightness LED (light-emitting diode) technology and the maturity of high-power LED production technology, due to its many advantages such as low consumption, high efficiency, small size, light weight and long life, LED is a new generation of environmentally friendly Solid-state lighting sources are widely used. At present, the luminous efficiency of high-power GaN-based white LEDs (blue light + phosphor) can reach 150 LM / W. Generally, the internal quantum efficiency of GaN-based LEDs can reach more than 80%. However, the refractive index of GaN is as high as 2.5, which has a large contrast with the refractive index of air. The critical angle of total reflection at the interface with air is only 23.6°, so the light extraction efficiency of GaN-based LEDs ...

Claims

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Application Information

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IPC IPC(8): H01L33/44H01L33/00H01L33/50
Inventor 孙卓陈晓红
Owner SUZHOU SUNLIGHTS TECH
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