Film-like resin composition for semiconductor sealing filling, manufacturing method of semiconductor device, and semiconductor device

A technology of resin composition and manufacturing method, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor device, chemical instrument and method, etc., can solve the problems of poor electrical conductivity, reduced connection reliability, poor connection, etc., and achieves excellent connection reliability, Good electrical conductivity and connection reliability, and the effect of suppressing the occurrence of sinking

Inactive Publication Date: 2015-08-05
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] However, in the conventional pre-supply method, there is a problem that the filler compounded to reduce the thermal expansion coefficient of the sealing resin is sandwiched between the bump and the substrate electrode, causing a poor connection called trapping and causing a conductive defect. Defects, or starting from the sandwiched filler, cracks occur on bumps and substrate electrodes, reducing connection reliability

Method used

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  • Film-like resin composition for semiconductor sealing filling, manufacturing method of semiconductor device, and semiconductor device
  • Film-like resin composition for semiconductor sealing filling, manufacturing method of semiconductor device, and semiconductor device
  • Film-like resin composition for semiconductor sealing filling, manufacturing method of semiconductor device, and semiconductor device

Examples

Experimental program
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Embodiment 1～10、 comparative example 1～6）

[0167] According to the configuration shown in Tables 1 to 3, Examples 1 to 10 and Comparative Example 1 were manufactured by laminating the film-like resin compositions A to K produced by the method shown below using a roll laminator heated to 50°C. ~6 film-like composition for sealing and filling semiconductors.

[0168] (film resin composition A)

[0169]45 g of phenoxy resin "PKCP80" (manufactured by Inchem Corporation, product name), 30 g of multifunctional epoxy resin "EP1032H60" (manufactured by Japan Epoxy Resin Co., Ltd., product name), and liquid anhydride "YH307" (Nippon Epoxy Resin Co., Ltd. Co., Ltd., product name) 20 g, silica filler "SE2050" (Admatechs Co., Ltd., product name, average particle size 0.4 to 0.6 μm) 100 g, adipic acid (Sigma-Aldrich) 3 g, solid accelerator " TPP-K" (manufactured by Hokko Chemical Industry Co., Ltd., product name) 1 g is dispersed and dissolved in methyl ethyl ketone solvent to prepare a varnish, and the varnish is coated on a sepa...

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Abstract

Disclosed is a film-like resin composition for sealing and filling a semiconductor, which is provided with a first layer composed of a first resin composition containing a thermosetting resin and a filler, and a second layer composed of a second resin composition containing a flux agent. The mass ratio of the filler in the second resin composition to the total quantity of the second resin composition is smaller than the mass ratio of the filler in the first resin composition to the total quantity of the first resin composition.

Description

technical field [0001] The present invention relates to a film-like resin composition for semiconductor sealing filling, a method for manufacturing a semiconductor device, and a semiconductor device. Background technique [0002] In recent years, with progress in miniaturization and high performance of electronic equipment, semiconductor devices are required to be miniaturized, thinned, and improved in electrical characteristics (response to high-frequency transmission, etc.). Along with this, there has been a shift from the conventional method of mounting a semiconductor chip on a substrate by wire bonding to a flip-chip connection method in which conductive protruding electrodes called bumps are formed on the semiconductor chip and directly connected to substrate electrodes. [0003] As the bumps formed on the semiconductor chip, bumps made of solder or gold are used, but bumps having a solder layer or tin layer structure formed on the tips of copper pillars have begun to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/18H01L21/60
CPCH01L2924/014B32B2457/14H01L2224/32225H01L2224/73204B32B2264/105H01L2224/29298H01L24/29H01L2224/16225H01L2224/2929H01L2224/29082H01L2224/16227H01L2924/01029H01L2924/00013B32B27/20H01L2924/351H01L2924/15311H01L2224/05568H01L2224/05573H01L2924/00014H01L2224/13099H01L2224/05099H01L2224/13599H01L2224/05599H01L2224/29099H01L2224/29599H01L2924/3512H01L2924/00H01L2224/29199H01L2224/29299
Inventor 榎本哲也永井朗宫泽笑本田一尊
Owner RESONAC CORPORATION
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