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Semiconductor packaging structure and manufacturing method thereof

A technology of packaging structure and manufacturing method, which is applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of easily increasing the size of wireless devices, unfavorable thinning and miniaturization of wireless devices, and achieve Ensuring wireless signal quality and reducing size

Active Publication Date: 2013-08-21
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to generate multiple frequencies, it is generally necessary to install multiple antennas in the wireless device, so it is easy to increase the size of the wireless device, which is not conducive to the thinning and miniaturization of the wireless device

Method used

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  • Semiconductor packaging structure and manufacturing method thereof
  • Semiconductor packaging structure and manufacturing method thereof
  • Semiconductor packaging structure and manufacturing method thereof

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Embodiment Construction

[0014] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are for reference only The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0015] In the figures, structurally similar units are denoted by the same reference numerals.

[0016] Please refer to figure 1 , which shows a cross-sectional view of a semiconductor package structure according to an embodiment of the present invention. The semiconductor package structure 100 of this embodiment can be used in a wireless electronic device (not shown), and the semiconductor package structure 100 includes a substrate 102, a chip 104, a passive ...

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Abstract

The invention provides a semiconductor packaging structure and a manufacturing method thereof. The manufacturing method comprises the steps of forming a first packaging rubber body to wrap a chip on a substrate, then sequentially forming a first metal layer, a second packaging rubber body, a second metal layer and a third packaging rubber body in a stacked mode, and forming a first exposure metal layer and a second exposure metal layer on the third packaging rubber body, wherein the length of the first exposure metal layer is different from that of the second exposure metal layer. The semiconductor packaging structure can be of a multi-band frequency antenna structure, and can greatly reduce the size of the antenna structure.

Description

technical field [0001] The invention relates to a semiconductor packaging structure and a manufacturing method thereof, in particular to a semiconductor packaging structure with a multi-frequency antenna and a manufacturing method thereof. Background technique [0002] In a wireless network, such as wireless PAN (personal area network), wireless LAN (local area network), wireless WAN (wide area network), cellular network, to provide wireless connection between devices in any wireless network or system and When communicating, it is necessary to be equipped with a receiver and a transmitter (or transceiver) with an antenna to effectively transmit (transmit) the required signal to other components in the wireless network, or to receive signals from other components in the wireless network. required signal. [0003] In existing wireless communication systems, antennas of wireless devices are generally sealed or installed on printed circuit boards or packaging substrates. Under...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/66H01L21/60
CPCH01L2224/16225H01L2924/19105
Inventor 竺炜棠曹登扬
Owner ADVANCED SEMICON ENG INC