Voltage divider for preventing disconnection of led wires and method of use thereof

Abstract

The invention provides a partial pressure device for preventing an LED leading wire from being disconnected and a use method of the partial pressure device, and relates to the packaging technology of light-emitting semiconductors. The partial pressure device for preventing the LED leading wire from being disconnected is used for dispersing the stress on the periphery of the electrode leading wire and solving the problems of short circuits and electric leakage caused by silver colloid. The partial pressure device comprises a bottom and a leading-wire lifting part connected to the bottom. The bottom is arranged at the middle position of the leading-wire lifting part. A certain inclined angle is formed upwards from the bottom by the leading-wire lifting part. A fixing object used for fixing the leading wire and being communicated with the leading wire is arranged at the upper portion of the leading-wire lifting part. A first-grade leading-wire welding position is arranged at the bottom or the lower portion of the leading-wire lifting part. The fixing object is connected with the first-grade leading-wire welding position through a leading wire. The bottom comprises a chip fixing area used for fixing an LED chip and conducting heat on the chip. A welding disc is arranged on the chip fixing area. A transparent hard protective sleeve used for protecting the leading wire is connected at the end portion, arranged outside the fixing object, of the leading-wire lifting part. The protective sleeve is a strip-shaped long groove. The bottom and the leading-wire lifting part are both made of metal, wherein the leading-wire lifting part is made of thermal bimetal.

Description

technical field [0001] The invention relates to the packaging technology of light-emitting semiconductors. Background technique [0002] For the packaging methods of existing high-power LED light-emitting devices, see Figure 9 scheme shown. The LED chip 7 is fixed in the chip groove 5 of the bracket 4 through the silver glue 6 . The lead wire 1 connects the electrode of the LED chip with the electrode wire 3 on the bracket. The LED chip is fixed in the chip groove by sealing glue. When this LED device is working, the internal junction temperature of the chip will exceed 100 degrees Celsius, and the temperature in the lamp cavity is also 70-90 degrees Celsius. The sealant in the chip slot is made of epoxy resin material as an example. When the lead wire is gold wire, the epoxy resin will have obvious thermal expansion and contraction under the temperature difference of tens of degrees, and the expansion coefficient of gold wire is only its Below one-fifth, it is not obvi...

AI Technical Summary

Problems solved by technology

Too much silver glue will pile up around the chip, causing chip short circuit or leakage; too little silver glue may lead to weak die bonding

Because the surface of the chip coated with silver glue is very small, errors often occur in the grasp of the amount of silver glue and the application of the position. In the case of sufficient amount, inaccurate dispensing positions will also cause short circuits due to uneven distribution of silver glue or leakage problem

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