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Chip-inlaid flooring material using pla resin

A technology for inlaid floors and floor materials, applied in floor covering, synthetic resin layered products, applications, etc., can solve problems such as insufficient strength and widening cracks, and achieve the effect of ensuring dimensional stability and rapid installation

Inactive Publication Date: 2013-09-04
LG HAUSYS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, typical environmentally friendly flooring materials have insufficient strength, so there are defects in formation or handling and cracks widen when there is heating in use

Method used

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  • Chip-inlaid flooring material using pla resin
  • Chip-inlaid flooring material using pla resin
  • Chip-inlaid flooring material using pla resin

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Embodiment Construction

[0034] [best way]

[0035] The above and other aspects, features and advantages of the present invention will become apparent from the following detailed description of the embodiments, taken in conjunction with the accompanying drawings. It should be understood that the present invention is not limited to the following embodiments and may be embodied in various ways, and the embodiments are provided to provide complete disclosure of the present invention and thorough understanding of the present invention to those skilled in the art. The scope of the invention is limited only by the claims. Throughout the specification, the same components are denoted by the same numerals.

[0036] Polylactic acid (PLA) is a thermoplastic polyester of lactide, or lactic acid, which can be prepared by the polymerization of lactic acid obtained from the fermentation of starch extracted from renewable plant resources such as corn and potatoes. The PLA resin is an environmentally friendly mater...

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Abstract

According to one embodiment of the present invention, a chip-inlaid flooring material using a PLA (polylactic acid) resin comprises: from the top, a chip-inlaid layer, a dimensional-stability layer, and a base material layer. One of the chip-inlaid layer and the base material layer includes PLA as a binder.

Description

technical field [0001] Embodiments of the present invention relate to chip inlaid flooring materials using PLA resin. Background technique [0002] Flooring materials based on petroleum resins such as polyvinyl chloride (PVC) have been mainly used in buildings such as houses, apartments, offices, stores and the like. [0003] Polyvinyl chloride flooring is manufactured by extruding or calendering resins such as polyvinyl chloride. However, since PVC is a petroleum-based product, it may encounter serious supply problems due to the depletion of petroleum. [0004] In addition, since polyvinyl chloride flooring materials generate a large amount of toxic substances during use or disposal, their use must be suppressed as much as possible in terms of environmental protection. [0005] Therefore, in recent years, flooring materials based on environmentally friendly resins have attracted increasing attention as a substitute for polyvinyl chloride-based flooring materials. [0006...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/10E04F15/02
CPCB32B27/36B32B7/12B32B27/12B32B27/18B32B2255/10B32B2255/26B32B2307/412B32B2471/00E04F15/105E04F15/107Y10T428/24893Y10T428/2481Y10T428/24876B32B5/16E04F15/12
Inventor 权炫钟金芝英朴贵凤姜昌源权埈赫朴商仙金璋起李京珉黄承哲
Owner LG HAUSYS LTD
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