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Method for preventing bottom holes of circuit board from being blocked in copper plating

A copper plating technology for circuit boards and holes, which is used in the manufacture of multi-layer circuits and the formation of electrical connection of printed components. Effect

Inactive Publication Date: 2013-09-11
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the object of the present invention is to provide a method for copper-plating the bottom hole of the circuit board without blocking the hole, so as to solve the problem of blocking the hole due to the difficulty in removing copper wire and rubber slag during back drilling.

Method used

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Embodiment Construction

[0016] In order to illustrate the idea and purpose of the present invention, the present invention will be further described below in conjunction with specific embodiments.

[0017] The invention provides a method for copper-plating the bottom hole of a circuit board without blocking the hole.

[0018] Wherein the present invention mainly adopts following steps:

[0019] a. Making multi-layer boards: cutting copper clad laminates, making inner layer graphics and inner layer etching, and then laminating them to make multi-layer boards;

[0020] According to the requirements, the copper clad laminate is cut, and the dry film is pasted on the surface of the copper clad laminate, and then the produced film picture is covered on the dry film, exposed and developed to form an inner layer pattern, and then the inner layer of the copper clad laminate is etched , forming a single inner layer board with inner layer wiring;

[0021] A plurality of inner-layer boards are produced in the...

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PUM

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Abstract

The invention discloses a method for preventing bottom holes of a circuit board from being blocked in copper plating. After holes are formed in the circuit board in a drilling mode, electroless copper plating and full-plate flash plating are carried out, so the thickness of copper in each hole reaches 5-7um, then a segmentation drilling mode is adopted, drilling is carried out according to the back drilling depth ratio of 1:2:3:4, and a drill bit is taken out after drilling is carried out each time, so formed copper wires and glue residues are taken out from the holes. Due to the segmentation drilling mode, scraps in back drilling holes can be effectively removed, and the problem of hole blocking caused by the fact that the copper wires and the glue residues are difficult to remove is avoided, and quality of products is improved.

Description

Technical field: [0001] The invention belongs to the technical field of printed circuit board production, and in particular relates to a method for copper-plating the bottom holes of the circuit board without blocking the holes. Background technique: [0002] With the continuous improvement of the transmission rate of electronic products and the rapid development of communication technology, electronic products have higher and higher requirements for signal distortion problems such as reflection, scattering and delay during PCB board signal transmission, and higher and higher requirements for the integrity of signal transmission. getting harsher. [0003] During the manufacturing process of the PCB board, it is necessary to perform copper plating on the through holes to form a conductive layer to realize the electrical connection between the inner circuit boards. The function of back drilling is to drill out the through-hole segments that do not play any connection or trans...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42H05K3/46
Inventor 彭君李学明翟青霞林楠闫陇周
Owner SHENZHEN SUNTAK MULTILAYER PCB
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