Cleaning system for selection plating product developing process

Abstract

The invention relates to a cleaning system for a selection plating product developing process. The system comprises a developing bath, a releasing and rinsing bath, a neutralization bath, a front rinsing bath, a cleaning bath and a rear rinsing bath, wherein the front rinsing bath comprises a plurality of first branch rinsing baths which can be filled with ionized water from front to back; and the rear rinsing bath comprises a first rear rinsing bath group and a second branch rinsing bath group from front to back, wherein the first rear rinsing bath group comprises a plurality of second branch rinsing baths and can be filled with municipal water, and the second branch rinsing bath group comprises a plurality of third branch rinsing baths and can be filled with deionized water. The system also comprises a temporary storage cylinder, wherein the front rinsing bath and the second rear rinsing bath group are respectively connected with the temporary storage cylinder and respectively used for supplying deionized water to the temporary storage cylinder; a sodium bicarbonate solution is supplied to the temporary storage cylinder; and the temporary storage cylinder is connected with the neutralization bath and used for supplying neutralizing liquid to the neutralization bath. The cleaning system for the selection plating product developing process can be used for controlling water quality of each section and cleaning, is advantageous to smoothly removing flowing slag, and can be used for solving the problem that a flexible printed circuit board cannot be clearly cleaned and increasing the utilization rate of deionized water.

Description

technical field [0001] The invention relates to a cleaning system used in the development process of a flexible printed circuit board in pattern electroplating. Background technique [0002] In the development process of pattern electroplating (blind hole plating) of flexible printed circuit boards, after the development is completed, it needs to be cleaned by spraying city water, and then sprayed and cleaned by warm city water and general city water, followed by acid cleaning ( sulfuric acid), and finally sprayed with pure water for cleaning. The specific cleaning system used is as attached figure 1 shown. The cleaning system mainly includes developing tanks (1 and 2) with potassium carbonate solution at 30°C, discharge washing tank 3 for supplying city water for single-side spraying, warm water washing tank 10 filled with city water at 40°C, and The 1# to 4# washing tanks for the market water, the cleaning tank 6 filled with sulfuric acid, and the 5# to 8# washing tanks...

AI Technical Summary

Problems solved by technology

[0003] However, since the developed flexible printed circuit board products and the scum remaining at the bottom of the blind holes are weakly acidic, when they encounter acidic city water and sulfuric acid cleaning, the products and the remaining scum will harden rapidly , the cleaning in the later stage cannot effectively remove the residual scum in the blind hole, so that in the subsequent copper plating, the residual scum on the bottom of the hole and the hole wall hinders copper plating, resulting in poor hole breaking

Images