Magnetic epoxy resin powder solvent and its method for packaging inductance

Abstract

The invention relates to a magnetic epoxy resin powder solvent and a method for packaging an inductor by the utilization of the magnetic epoxy resin powder solvent. The magnetic epoxy resin powder solvent is characterized by comprising the following substances: 25-50% of epoxy resin powder coating material, 5-25% of curing agent, 20-50% of soft magnetic ferrite core ground powder particles and 20-50% of organic solvent. The method for packaging the inductor by the utilization of the magnetic epoxy resin powder solvent includes the following steps: performing full diluting with the organic solvent, enabling an inductance coil to face down, immersing the inductance coil into the magnetic epoxy resin powder solvent, then pacing the inductance coil on a baking rack to bake the inductance coil for 5-30min, sending the inductance coil into an oven, setting the temperature at 80-120DEG C, and baking the inductance coil for 1-3 hours. The magnetic epoxy resin powder solvent has the advantages of being capable of promoting the inductance of the inductor and saturation resistance of a current, low in consistence, good in mobility, easy to use for coating, free of sticking, and capable of promoting production efficiency; when heated, the magnetic epoxy resin powder solvent is directly solidified and will not flow, and thus uniformity of a coating can be kept; the inductance value is made to be stable, the change of error is small, quality is more reliable, and the magnetic epoxy resin powder solvent is mainly applicable to packaging of a direct-insertion inductor.

Description

technical field [0001] The invention relates to a magnetic epoxy resin powder solvent for packaging in-line inductors, a manufacturing process thereof and a method for packaging in-line inductors. Background technique [0002] With the miniaturization of electronic products, the advent of various types of high-definition displays and the popularization of low-cost LED lighting products, there are higher requirements for existing inductance devices. Change. Moreover, a shielding function is required to reduce the interference of the electromagnetic field generated by the inductance device on other components. At present, the existing plug-in inductance devices on the market have a single function. Although there are mass production of epoxy resin powder coating inductors, they have no electromagnetic shielding ability; If the change is large, the position gap between the magnetic core and the magnetic cover is different, the inductance value and the current resistance capac...

AI Technical Summary

Problems solved by technology

At present, the existing plug-in inductance devices on the market have a single function. Although there are mass production of epoxy resin powder coating inductors, they have no electromagnetic shielding ability; The change is large, the position gap between the magnetic core and the magnetic cover is different, the inductance value and current resistance will change, and the material cost of the magnetic cover is very high

The Chinese patent with the patent application number: 200410097119.1 discloses a surface mount coil component and its manufacturing method. The patent provides a rubbery epoxy resin encapsulation material, because soft magnetic ferrite is added to this gelatinous substance After the powder is still a gelatinous substance, the consistency is high and the fluidity is poor. It is difficult to package the inductor, which reduces the efficiency and uniformity of the package.

In addition, when using this kind of glue-like epoxy resin material, it will first melt and have fluidity during the high-temperature heating and curing process. During baking, the glue will flow to the bottom or flow out along the line groove, resulting in a thin surface after drying. A lot of accumulation at the bottom or flow out of the wire groove reduces the uniformity of the packaging coating