Structural Design Method of Sandwich Microstrip Antenna Based on Support Vector Machine

A technology of support vector machines and microstrip antennas, applied in antennas, resonant antennas, calculations, etc., can solve the problem of not optimizing the structural parameters of interlayer microstrip antennas, the design of electrical and mechanical properties of interlayer microstrip antennas, and the lack of comprehensive Consider issues such as the influence of honeycomb and skin electrical properties

Active Publication Date: 2016-09-28
XIDIAN UNIV
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Problems solved by technology

However, the method mentioned above has the following defects: (1) The influence of honeycomb and skin on electrical performance is not considered comprehensively
(2) The structure of the interlayer microstrip antenna is not designed by combining the electrical and mechanical properties of the interlayer microstrip antenna
(3) The structural parameters of the sandwich microstrip antenna are not optimized

Method used

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  • Structural Design Method of Sandwich Microstrip Antenna Based on Support Vector Machine
  • Structural Design Method of Sandwich Microstrip Antenna Based on Support Vector Machine
  • Structural Design Method of Sandwich Microstrip Antenna Based on Support Vector Machine

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Embodiment Construction

[0098] The present invention will be described in further detail below with reference to the accompanying drawings.

[0099] Sandwich microstrip antenna is mainly composed of microstrip antenna, dielectric board, honeycomb, upper and lower panels, figure 1 A schematic diagram of the composition of the interlayer microstrip antenna structure is given. In the figure, 1 is the upper panel, 2 is the honeycomb, 3 is the microstrip antenna layer, and 4 is the lower panel. figure 2 Yes figure 1 The schematic diagram of the specific structure of the microstrip antenna in the microstrip antenna layer is shown. refer to figure 1 , assuming that the thickness of the dielectric plate and the thickness of the upper and lower panels of the sandwich microstrip antenna are represented by the variables H and Hm, respectively. refer to figure 2 , assuming that the patch length and patch width of the microstrip antenna are represented by the variables b and a, respectively. refer to ima...

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Abstract

The invention belongs to the technical field of antennas and particularly relates to a support vector machine-based structure design method for a sandwich microstrip antenna. The support vector machine-based structure design method for the sandwich microstrip antenna is characterized by comprising at least twelve steps of building a structural parameter optimization model of the sandwich microstrip antenna under the condition that mechanical performance indexes meet requirements, selecting out reasonable structural parameters, and the like. The support vector machine-based structure design method for the sandwich microstrip antenna is used for guiding or assisting a designer to design the structural dimension parameters of the sandwich microstrip antenna.

Description

technical field [0001] The invention belongs to the technical field of antennas, in particular to a support vector machine-based sandwich microstrip antenna structure design method, which can be used to guide or assist designers in designing structural size parameters of the sandwich microstrip antenna. Background technique [0002] The sandwich microstrip antenna has both the antenna function and the load bearing function. It is a composite material structure with both antenna and load-bearing functions. In addition to maintaining the original structural performance, it also has the advantages of not affecting the aerodynamic shape of the structure, flexible antenna placement, and reducing electromagnetic waves. Compatibility issues and other advantages have positive significance for improving structure utilization efficiency and antenna performance. The sandwich microstrip antenna consists of a microstrip antenna layer, a honeycomb layer, and upper and lower panels. figur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50H01Q9/04H01Q13/08
Inventor 黄进章丹周金柱宋立伟郭冬来
Owner XIDIAN UNIV
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