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Laser processing equipment with suction device

A laser processing and equipment technology, applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of large suction volume, high maintenance cost and operating cost, and achieve the effect of cost saving

Active Publication Date: 2016-05-04
TRUMPF LASERSYST FOR SEMICON MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Significant disadvantages due to the large suction volume in terms of installation space and costs
In addition, residual contamination of the components of the laser processing plant located inside the mechanical housing, in particular contamination of the optics and mechanical guides, leads to high maintenance and operating costs due to failure and wear
In addition, residual pollutants (especially in an unaccumulated state) may pose a health risk due to excessive dust concentrations in the air

Method used

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  • Laser processing equipment with suction device
  • Laser processing equipment with suction device
  • Laser processing equipment with suction device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] figure 1 The laser processing device 1 shown in includes a workpiece support 2, a laser processing unit (such as a laser processing head) 3 arranged above the workpiece support 2, a suction opening 5 and a housing 6 arranged below the workpiece support 2, The laser processing unit is used to process the workpiece 4 positioned on the workpiece support 2, the housing separates the workpiece support 2, the laser processing unit 3, and the suction opening 5 from its external environment, and the housing is in addition to The air inflow opening 7 is completely enclosed. The fumes and dust layers that occur during the laser machining of the workpiece 4 are sucked through the suction opening 5 (flow arrow 8 ). A supplementary inflow of air is made through the inflow opening 7 to equalize the low pressure generated during the suction inside the housing 6 . The suction opening 5 adjoins a waste material container 9 in order to receive therein the waste material sucked during p...

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PUM

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Abstract

A laser machining system includes a workpiece support, a laser machining unit arranged above the workpiece support and for machining a workpiece located on the workpiece support, at least one extraction opening beneath the workpiece support, and an enclosure separating the workpiece support, the laser machining unit and the at least one extraction opening from an external environment. The enclosure includes at least one air inflow opening arranged above the workpiece support and relative to the at least one extraction opening such that, during operation of the laser machining system, a pressure difference between the air inflow opening and the at least one extraction opening establishes a flow of air between the workpiece support and the laser machining unit, in which the flow of air separates the interior of the enclosure into a laser machining area beneath the flow band and a laser free area above the flow band.

Description

technical field [0001] The invention relates to a laser processing equipment. Background technique [0002] Such a laser processing system with a suction device is known, for example, from US Pat. No. 6,229,112 B1. The laser cutting systems described in the literature have a device for extracting cutting dust and / or fumes arranged below the machine tool in a chamber and are completely enclosed by the machine housing except for the inflow opening. This balances the low pressure generated inside the encapsulating laser processing equipment during pumping. In this case, the inflow opening is realized at the level of the workpiece carrier by means of a slot in the workpiece supply area. As a result, the air flow generated assists the suction under the workpiece. Furthermore, the (secondary) inflow openings provided in the roof of the housing ensure that the entire inner area of ​​the housing is flowed through in order to avoid accumulation of particles in so-called “dead spac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/14B23K9/32
CPCB08B5/04B08B15/04B23K26/142
Inventor A·特维塞尔曼D·绍特
Owner TRUMPF LASERSYST FOR SEMICON MFG