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Autocatalytic plating bath composition for deposition of tin and tin alloys

一种含水自催化镀锡液、组合物的技术，应用在液态化学镀覆、金属材料涂层工艺、涂层等方向

Inactive Publication Date: 2013-10-02
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The autocatalytic tin plating bath compositions known in the art present problems with the balance between preventing unwanted tin plating out and sufficient deposition rates for practical applications

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] Embodiment 1 (comparison)

[0069] Use the following autocatalytic tin bath containing 7.6 g / l SnCl 2 , 51ml of TiCl 3 Aqueous solution (15wt.-% TiCl 3 , 10wt.-% of HCl), 184.8g / l of potassium pyrophosphate, 38.8g / l of potassium citrate and 100mg / l of sodium thiosulfate. No stabilizing additives are added.

[0070] The stability number of this bath is 1. Therefore, tin plating from this bath composition is not feasible.

Embodiment 2

[0072] To the bath composition according to example 1 was added 5 mg / l of the HCl adduct of the compound according to formula (1), wherein R1 and R8=methyl, R2, R3, R4, R5, R6 and R7=H.

[0073] The stability number of this bath is 5. The tin plating rate was 2.1 µm / 15 minutes.

Embodiment 3

[0074] Embodiment 3 (comparison)

[0075] Use an autocatalytic tin plating bath containing 15 g / l of SnCl 2 , 90ml of TiCl 3 Aqueous solution (15wt.-% TiCl 3 , 10wt.-% of HCl), 58.4g / l of potassium pyrophosphate, 61.3g / l of potassium citrate, 70g / l of EDTA and 100mg / l of sodium thiosulfate. The pH was adjusted to 9.9 using ethylenediamine. No stabilizing additives are added.

[0076] The stability number of this bath is 1. Therefore, tin plating from this bath composition is not feasible.

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PUM

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Abstract

An autocatalytic tin plating bath containing Sn2+ ions, Ti3+ ions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.

Description

technical field [0001] The present invention relates to an autocatalytic bath composition for depositing tin and tin alloys and a method for applying said autocatalytic bath composition. The present invention relates to the manufacture of electronic components such as printed circuit boards, IC substrates and semiconductor wafers. Background technique [0002] Tin and tin alloy layers on electronic components such as printed circuit boards, IC substrates, and semiconductor wafers serve as solderable and bondable finishes in subsequent manufacturing steps of such electronic components. [0003] Tin and tin alloy layers are typically deposited on metal contact areas such as contact pads and bump structures. The contact areas are usually made of copper or copper alloys. If such contact pads can deposit tin and tin alloy layers by electrical contact, such layers are deposited by conventional electroplating methods. However, in many cases the individual contact areas cannot ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/31C23C18/52
CPCC23C18/31C23C18/52C09D1/00
Inventor 阿恩德·基利安延斯·韦格里希特伊莎贝尔-罗达·希施科恩
Owner ATOTECH DEUT GMBH
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