Breaking-through transient voltage inhibitor
A transient voltage suppression and punch-through technology, which is applied in the direction of electric solid-state devices, semiconductor/solid-state device components, circuits, etc., can solve the problem of incomplete and effective protection of positive and negative electrostatic pulses, forward and reverse Large difference in clamping ability, poor ESD protection effect, etc., to achieve good application prospects, good ESD protection effect, and simple manufacturing method
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[0033] The present invention will be further described below in conjunction with the accompanying drawings.
[0034] Such as figure 1 As shown, a punch-through transient voltage suppressor includes P substrate 01, and the doping concentration of P substrate 01 is 1×10 15 ~1×10 16 atom / cm 3 Between, the upper surface of the P substrate 01 is provided with an oxide layer 02, the oxide layer 02 is divided into an anode area and a cathode area from the middle, the thickness of the oxide layer 02 is 0.8um~1.2um, and the oxide layer 02 is embedded in the P The depth inside the substrate 01 is 0.1um~0.3um;
[0035] The upper surface of the P substrate 01 is located in the anode region and is provided with an N well 03 with a second conductivity type, and the doping concentration of the N well 03 is 7×10 18 ~1×10 19 atom / cm 3 Between, the N well 03 is provided with a first N+ active injection region 05 with the second conductivity type;
[0036] The upper surface of the P sub...
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