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Photo-curing polysiloxan composition, protective film and element containing protective film

A polysiloxane and composition technology, applied in the field of components, can solve the problems of poor hardness and no chemical resistance of the hardened film, and achieve the effect of improving chemical resistance

Active Publication Date: 2013-10-23
CHI MEI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the sensitivity of the photosensitive resin composition in the above patent in the photolithography process can be accepted by the industry, the cured film formed by it has no chemical resistance and poor hardness

Method used

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  • Photo-curing polysiloxan composition, protective film and element containing protective film
  • Photo-curing polysiloxan composition, protective film and element containing protective film
  • Photo-curing polysiloxan composition, protective film and element containing protective film

Examples

Experimental program
Comparison scheme
Effect test

preparation example A-1

[0131] In a three-necked flask with a capacity of 500 ml, add 0.30 moles of methyltrimethoxysilane (hereinafter referred to as MTMS), 0.65 moles of phenyltrimethoxysilane (hereinafter referred to as PTMS), 0.05 moles of "GF-20" and 200 grams of propylene glycol monoethyl ether (hereinafter referred to as PGEE), and while stirring at room temperature, add oxalic acid aqueous solution (0.40 gram oxalic acid / 75 gram H 2 O). Next, immerse the flask in a 30°C oil bath and stir for 30 minutes, then raise the temperature of the oil bath to 120°C within 30 minutes, and when the internal temperature of the solution reaches 105°C, continue heating and stirring for polycondensation for 6 hours, and then use The solvent is removed by distillation to obtain the polysiloxane polymer (A-1).

preparation example A-2

[0133] In a three-necked flask with a volume of 500 milliliters, add 0.40 moles of dimethyldimethoxysilane (hereinafter referred to as DMDMS), 0.40 moles of PTMS, 0.10 moles of phenyltriethoxysilane (hereinafter referred to as PTES), 0.05 moles of "GF-20", 0.05 moles of 3-(trimethoxysilyl) propylglutaric anhydride (hereinafter referred to as TMSG), 100 grams of PGEE, and 100 grams of diacetone alcohol (hereinafter referred to as DAA), and Add oxalic acid aqueous solution (0.40 g oxalic acid / 75 g H 2 O). Next, immerse the flask in a 30°C oil bath and stir for 30 minutes, then raise the temperature of the oil bath to 120°C within 30 minutes, and when the internal temperature of the solution reaches 110°C, continue heating and stirring for 5 hours of polycondensation, and then use The solvent is removed by distillation to obtain the polysiloxane polymer (A-2).

preparation example A-3

[0135] In a three-necked flask with a capacity of 500 milliliters, add 0.60 moles of DMDMS, 0.30 moles of PTMS, 0.10 moles of 3-glycidoxypropyltrimethoxysilane (hereinafter referred to as TMS-GAA) and 200 grams of PGEE, And while stirring at room temperature, add oxalic acid aqueous solution (0.35 g oxalic acid / 75 g H 2 O). Next, immerse the flask in a 30°C oil bath and stir for 30 minutes, then raise the temperature of the oil bath to 120°C within 30 minutes, and when the internal temperature of the solution reaches 105°C, continue heating and stirring for polycondensation for 6 hours to obtain Polysiloxane polymer (A-3).

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Abstract

A photo-curing polysiloxane composition includes a polysiloxane, a quinonediazidesulfonic acid ester, a fluorene-containing compound, and a solvent. The polysiloxane is obtained by subjecting a silane monomer component to condensation. A protective film formed from the photo-curing polysiloxane composition, and an element containing the protective film, are also discussed.

Description

technical field [0001] The present invention relates to a photocurable polysiloxane composition, in particular to a photocurable polysiloxane composition containing a polysiloxane macromolecule and a fluorene compound, whereby the photocurable polysiloxane A protective film formed by an alkane composition, and an element having the protective film. Background technique [0002] In recent years, in the field of integrated circuits for liquid crystal displays or organic electroluminescent displays, the demand for miniaturization of patterns required in the photolithography process is even greater as the size decreases. In order to achieve miniaturized patterns, it is generally formed by exposure and development of positive-type photosensitive materials with high resolution and high sensitivity, and positive-type photosensitive materials composed of polysiloxane polymers are gradually used in the industry. mainstream. [0003] Japanese Patent Application Laid-Open No. 2008-10...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075G03F7/00
CPCG03F7/0757G03F7/0233Y10T428/24802
Inventor 吴明儒施俊安
Owner CHI MEI CORP
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