Method for packaging LED light source
A technology of LED light source and packaging method, applied in electrical components, electro-solid devices, circuits, etc., can solve the problems of short life and unsafe, achieve the effect of improving life, reducing heat and light decay, and being suitable for mass production
Inactive Publication Date: 2013-10-23
ANHUI KEFA INFORMATION SCI & TECH
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] At present, the light source used in lamps and billboards is mainly to package LED (light-emitting diode) light source, and the main process of LED packaging method is solid crystal, baking, wire bonding, dispensing, baking, light separation and color separation, Packaging, and in the solid crystal process, it is mainly to fix the light-emitting diode chip that is equipped with the size of the bracket or the aluminum substrate on the bracket or the aluminum substrate, but because the power of the packaged light source is greater, the driving current required is greater. Because the voltage of the light-emitting diode chip is fixed (the voltage of blue-green light is generally 2.8-3.4V, and the voltage of red-yellow light is generally 1.8-2.2V), then the more heat is emitted, the greater the light decay , the life is shorter, and it is not safe
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0013] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0014] Such as figure 1 As shown, a method for encapsulating an LED light source comprises the following steps:
[0015] Step 1. Die bonding: use a conductive silver paste to attach two light-emitting diode chips in parallel to a bracket through a die bonding machine;
[0016] Step 2. Wire bonding: use a wire bonding machine to use pure gold wires to connect the two LED chips in parallel to connect the negative pole of the first LED chip to the positive pole of the second LED chip, and then connect the first LED chip The positive electrode of the chip, the negative electrode of the second LED chip and the positive and negative electrodes on the support are connected together;
[0017] Step 3. Dispensing silica gel: apply protective silica gel on the surface of the light-emitting diode chip through a dispensing machine;
[0018] Ste...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a method for packaging an LED light source. The method for packaging the LED light source is characterized by including the following steps of step 1, bonding, specifically, pasting two light emitting diode chips onto one support in parallel by utilizing conductive silver paste through a die bonder, step 2, wire bonding, specifically, connecting the two light emitting diode chips in a manner that the negative pole of the first light emitting diode chip is connected with the positive pole of the second light emitting diode chip by utilizing pure gold through bonding equipment, and then connecting the positive pole of the first light emitting diode chip and the negative pole of the second light emitting diode chip with the positive pole and the negative pole on the support, step 3, silica gel application, specifically, coating the surfaces of the light emitting diode chips with protective silica gel through a dispenser, and step 4, carrying out light splitting and color splitting, specifically, carrying out the light splitting, the color splitting and packaging through an optical and electrical testing instrument. The method for packaging the LED light source can reduce drive current of the LED light source, reduce heat dissipation and luminance decrease and prolong service life under the condition that obtained power is not changed.
Description
technical field [0001] The invention relates to a packaging method of a light source, in particular to a packaging method of an LED light source. Background technique [0002] At present, the light source used in lamps and billboards is mainly to package LED (light-emitting diode) light source, and the main process of LED packaging method is solid crystal, baking, wire bonding, dispensing, baking, light separation and color separation, Packaging, and in the solid crystal process, it is mainly to fix the light-emitting diode chip that is equipped with the size of the bracket or the aluminum substrate on the bracket or the aluminum substrate, but because the power of the packaged light source is greater, the driving current required is greater. Because the voltage of the light-emitting diode chip is fixed (the voltage of blue-green light is generally 2.8-3.4V, and the voltage of red-yellow light is generally 1.8-2.2V), then the more heat is emitted, the greater the light decay...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L25/075
Inventor 黄波王玉珍孟成黄超
Owner ANHUI KEFA INFORMATION SCI & TECH