Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Joining sheet, electronic component, and producing method thereof

A bonding chip and wiring circuit substrate technology, applied in the bonding chip field, can solve the problems of low impact of solder joints, low bonding reliability, etc., and achieve the effect of inhibiting the reaction

Inactive Publication Date: 2013-10-30
NITTO DENKO CORP
View PDF10 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although tin-bismuth based solder particles melt at low temperatures, the solder joint formed by heating and melting has low impact and low joint reliability. Solder paste containing thermosetting resins such as epoxy resins (see, for example, JP-A-2006-150413)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Joining sheet, electronic component, and producing method thereof
  • Joining sheet, electronic component, and producing method thereof
  • Joining sheet, electronic component, and producing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0116] By adding 30 parts by volume of epoxy resin (Nippon Steel Chemical Co., Ltd., thermosetting resin, YSLV-80XY, curing temperature 150°C), acrylic resin (manufactured by KURARAY CO., LTD, thermoplastic resin, LA POLYMER, softening temperature 110° C.) 40 parts by volume, and 30 parts by volume of a phenolic resin (manufactured by Meiwa Kasei Co., Ltd., curing agent, MEH-7851SS) were mixed to obtain a resin composition. The obtained resin composition and solder particles (Sn / Bi=42% by mass / 58% by mass, melting point of 139° C., spherical shape, average particle diameter of 35 μm) were mixed at a volume ratio of resin composition:solder particles=25:75, Further, a blocked carboxylic acid (manufactured by NOF Corporation, Santacid H, monoalkyl vinyl ether blocked difunctional low molecular weight type carboxylic acid, dissociation temperature 160° C. °C) and kneaded using a kneader to obtain a mixture. The obtained mixture was molded at 125° C. into a sheet having a thickne...

Embodiment 2

[0118] Except that the blocked carboxylic acid (manufactured by NOF Corporation, Santacid H, monoalkyl vinyl ether blocked difunctional low molecular weight type carboxylic acid, dissociation temperature 160°C) was changed to blocked carboxylic acid (NOF Corporation Production, Santacid I, monoalkyl vinyl ether-terminated difunctional carboxylic acid, dissociation temperature 170° C.), a bonding sheet was produced in the same manner as in Example 1.

Embodiment 3

[0152] Example 3 (Performance Test of Solder Melting B of the Bonding Sheet of Example 1)

[0153] Prepare two wired circuit boards (refer to figure 1 (a)). After the two wired circuit boards were arranged so that the corresponding terminals were arranged to face each other with a gap, the bonding sheet of Example 1 was inserted therebetween, and the bonding sheet was brought into contact with the two wired circuit boards to obtain a laminated body ( refer to figure 1 (b)). Next, the obtained laminate was bonded by thermocompression at 125°C and 1 MPa (see figure 1 (c)). Thereafter, it was heated at 170°C for 30 minutes, thereby manufacturing an electronic component (see figure 1 (d)).

[0154] As a result of examining the melting of the solder in this electronic component, it was confirmed that the solder was melting.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
thicknessaaaaaaaaaa
softening pointaaaaaaaaaa
Login to View More

Abstract

The invention provides a joining sheet, electronic component, and producing method thereof. The joining sheet contains solder particles, a thermosetting resin, a thermoplastic resin, and a blocked carboxylic acid.

Description

technical field [0001] The present invention relates to a bonding sheet, an electronic component, and their manufacturing methods. More specifically, it relates to a bonding sheet, an electronic component to which a wired circuit board is bonded using the bonding sheet, and their manufacturing methods. Background technique [0002] It is known that a solder paste containing solder particles made of tin-bismuth based solder and an activator such as carboxylic acid is conventionally used for bonding between terminals of two wired circuit boards. Although tin-bismuth based solder particles melt at low temperatures, the solder joint formed by heating and melting has low impact and low joint reliability. Solder paste containing a thermosetting resin such as an epoxy resin (see, for example, JP 2006-150413 A). [0003] In Japanese Unexamined Patent Application Publication No. 2006-150413, solder paste is applied to the surface of a terminal by screen printing or the like, and the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/14B23K35/36B23K35/40H05K3/34
CPCC08G59/621C09J163/00H01L24/28C09J133/00H01L2224/83886H05K2203/0425B23K35/3613H01L2224/83101H05K2201/0129H05K3/323H05K3/3489B23K35/3618H01L2224/27436H05K3/368H05K1/0298C09J9/02B23K35/0233H01L24/11H05K13/0465H05K2201/10977B23K35/302C08L33/00B23K35/26B23K35/362H05K3/34
Inventor 江部宏史古川佳宏
Owner NITTO DENKO CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com