Preparation method for high-voltage element based on heat conduction of organic silicon rubber

Abstract

The invention provides a preparation method for a high-voltage element based on heat conduction of organic silicon rubber. The preparation method comprises steps: (1) a shell body for assembling of a high-voltage element is cleaned, and beforehand mixed rubber materials containing organic silicon rubber are stirred; (2) the mixed rubber materials are encapsulated in the cavity between the shell body and the high-voltage element which is assembled in the shell body; (3) the mixed rubber materials encapsulated in the cavity are subjected to (4) the mixed rubber materials are subjected to curing process, to the high-voltage element.

Description

technical field [0001] The invention relates to a method for preparing components on a high-voltage line, in particular to a method for preparing a high-voltage component based on silicone rubber heat conduction. Background technique [0002] At present, the materials used for potting high-heat, high-voltage components and components are mainly epoxy resin composite materials, but they mainly have the following disadvantages: (1) Poor thermal conductivity, and the above potting materials are all organic insulating materials , The thermal conductivity of the polymer cross-linked product formed after curing is only about 0.23W / m·K, which makes it difficult to conduct the heat generated by the high-voltage components potted in it. (2) Poor temperature impact resistance. Since epoxy perfusion materials are rigid perfusion materials, their thermal impact resistance is poor, especially in low temperature environments, where deformation and cracking are prone to occur. (3) Poor ma...

AI Technical Summary

Problems solved by technology

[0002] At present, the materials used for potting high-heat, high-voltage components and components are mainly epoxy resin composite materials, but they mainly have the following disadvantages: (1) Poor thermal conductivity, and the above potting materials are all organic insulating materials , the thermal conductivity of the polymer cross-linked product formed after curing is only about 0.23W / m·K, which makes it difficult to conduct the heat generated by the high-voltage components potted in it

(2) Poor thermal impact resistance. Since epoxy perfusion materials are rigid perfusion materials, their thermal impact resistance is poor, especially in low temperature environments, where deformation and cracking are prone to occur

(3) Poor maintainability. Epoxy perfusion materials are thermosetting materials. Once cured, it is difficult to peel off the components, so it cannot meet the needs of replacing components or reusing certain components.

In response to the above shortcomings, people choose oil seals to package high-voltage components. However, although oil seals have certain maintainability, their thermal conductivity and thermal shock resistance have not been significantly improved, and vibrations will also occur. oil leakage and rapid drop in insulation resistance

Images